Xilinx, Northwest Logic and Xylon Provide Low Cost FPGA-based MIPI Interfaces for Video Displays and Cameras
BEIJING, Sept. 9, 2014 /PRNewswire/ -- Xilinx, Inc. (NASDAQ: XLNX) and Northwest Logic and Xylon, Xilinx Premier Alliance Members, announce the availability of a low cost Xilinx FPGA-based MIPI interface IP that is optimized for cost sensitive video displays and cameras. The MIPIDisplay Serial Interface <http://www.mipi.org/specifications/display-interface> (DSI) and Camera Serial Interface 2 <http://www.mipi.org/specifications/camera-interface> (CSI-2) have become the industry connectivity standards for low cost video displays and cameras across a wide variety of embedded systems. Xilinx FPGAs can now be used to connect image sensors and ASSPs that support the CSI-2 and DSI standards for the development of high bandwidth applications supporting 4K2K and beyond. The release of the support for MIPI furthers Xilinx's Smarter Vision commitment by now enabling advanced real-time analytics and immersive display applications.
"MIPI DSI and CSI-2 is now the preferred standard for connecting low cost displays, cameras and video-capable application processors to Xilinx® 7 Series and Spartan® 6 FPGAs," said Aaron Behman, segment lead, broadcast and professional A/V business at Xilinx. "As a result, FPGAs are being incorporated into more MIPI-based products today than ever before, especially in products that support 4K2K and beyond."
Northwest Logic provides a full range of DSI (Host and Peripheral) and CSI-2 (Tx & Rx) Controller Cores. These cores fully support 1-4 lane and 8 lane (dual 4 lane) MIPI operation. The cores are delivered fully integrated with the PHY logic to implement Xilinx's low cost MIPI Interface technique. "The Xilinx low cost MIPI Interface approach will enable a whole new range of FPGA-based MIPI products. The Northwest Logic MIPI cores that support this technique are fully hardware validated and released," saidBrian Daellenbach, president at Northwest Logic.
Xylon provides a broad range of video processing IP Cores. Xylon has taken a Xilinx FPGA Mezzanine Card (FMC), which implements the low cost MIPI Interface approach, Northwest Logic's CSI-2 and DSI cores and its own cores running on an off-the-shelf Zynq® All Programmable SoC evaluation board (ZC702 & ZC706) to create a comprehensive demonstration system. The demonstration system takes a live video stream from an OmniVision CMOS sensor (OV16820), processes it in a Xilinx FPGA and then streams it to a MIPI-compatible display. "This demo system shows that low cost, FPGA-based MIPI systems can be developed quickly and reliably using this interface approach and associated logiBRICKS," saidDavor Kovacec, CEO of Xylon.
Xilinx is the world's leading provider of All Programmable FPGAs, SoCs and 3D ICs. These industry-leading devices are coupled with a next-generation design environment and IP to serve a broad range of customer needs, from programmable logic to programmable systems integration. For more information, visitwww.xilinx.com <http://www.xilinx.com/>.
Xylon is an electronics company focused on FPGA designs. The company was founded in 1995, and since then it has grown into a prominent provider of intellectual property in the fields of embedded graphics, video and networking. For more information, visitwww.logicbricks.com <http://www.logicbricks.com/>.
Stratasys triple-jetting technology is designed to allow the user to build products with up to three different materials in a single run, or even mix multiple material droplets to form new digital materials such as tough Digital ABS.
Joining the Objet500 Connex3 Color Multi-material 3D Printer <http://www.stratasys.com/3d-printers/design-series/precision/objet500-connex3> announced in January, the Objet500 Connex1 and Objet500 Connex2 offer designers and manufacturers superior versatility for materials, functionality and product realism capabilities.
Objet500 Connex1
Equipped with a large build envelope, the Objet500 Connex1 Multi-material 3D Printer can produce parts from three diverse materials in a single production run. This allows users to create assemblies with components formed from three different materials, or it can produce components that contain both rigid and flexible materials, such as rubber-like Tango and rigid Vero material. The 3D printer can build a part up to 19.3 in. x 15.4 in. x 7.9 in. (490mm x 390mm x 200mm) or a mixed tray of small parts. A larger material cabinet contains eight cartridges, resulting in more unattended run time and fewer material changeovers than previous models. Hot swapping -- or reloading material and support cartridges while the 3D printer is operating -- allows for continuous part production. Multi-material 3D printing achieves in a single, automated build what would be either impossible to achieve with conventional single-material 3D printers or would require hand assembly from multiple print jobs.
Objet500 Connex2
The Objet500 Connex2 Multi-material 3D Printer enables users to combine transparency, durability and flexibility in one part. It has all the capabilities of the Objet500 Connex1 plus the ability to combine droplets from two base materials to produce new materials or "Digital Materials." Digital ABS, for example, is the most durable material available for the Stratasys PolyJet process and is often used to produce mold cores and cavities for short-run injection molding. With more than 100 material options, Connex2 users can produce a variety of Shore A values in the same part with rigid or clear components, or can combine Digital ABS with pure Tango for strong over-molded handles and grips. The versatility of the Objet500 Connex2 also makes it ideal for creating custom manufacturing tools such as jigs and fixtures.
"Following the launch of the Objet500 Connex3 earlier this year, we saw the demand for additional multi-material 3D printers that can address a variety of applications in prototyping and manufacturing, such as tooling and molding," explains Stratasys' Senior Product Marketing ManagerRon Ellenbogen. "We were able to build on the success of our triple-jetting technology and expand the Objet500 Connex family with two 3D production systems that we believe set new standards for 3D printing price performance."
Stratasys Ltd. (Nasdaq:SSYS), headquartered in Minneapolis, Minnesota and Rehovot,Israel, is a leading global provider of 3D printing and additive manufacturing solutions. The company's patented FDM® and PolyJet⢠3D Printing technologies produce prototypes and manufactured goods directly from 3D CAD files or other 3D content. Systems include 3D printers for idea development, prototyping and direct digital manufacturing. Stratasys subsidiaries include MakerBot and Solidscape, and the company operates a digital-manufacturing service comprising RedEye, Harvest Technologies and Solid Concepts. Stratasys has more than 2,500 employees, holds over 600 granted or pending additive manufacturing patents globally, and has received more than 25 awards for its technology and leadership. Online at:www.stratasys.com <http://www.stratasys.com/> or http://blog.stratasys.com <http://blog.stratasys.com/>.
Stratasys and Objet are registered trademarks, and Objet500, Connex, PolyJet, are trademarks of Stratasys Ltd. and/or its subsidiaries or affiliates.
Note Regarding Forward-Looking Statements
The statements in this press release relating to Stratasys' beliefs regarding the capabilities and benefits consumers will experience from the Objet500 Connex1 and Objet500 Connex2 printers are forward-looking statements reflecting management's current expectations and beliefs. These forward-looking statements are based on current information that is, by its nature, subject to rapid and even abrupt change. Due to risks and uncertainties associated with Stratasys' business, actual results could differ materially from those projected or implied by these forward-looking statements. These risks and uncertainties include, but are not limited to: the risk that consumers will not perceive the benefits of the Objet500 Connex1 and Objet500 Connex2 printers to be the same as Stratasys does; the risk the Objet500 Connex1 and Objet500 Connex2 printers will not perform as expected; and other risk factors set forth under the caption "Risk Factors" in Stratasys' most recent Annual Report on Form 20-F, filed with the Securities and Exchange Commission (SEC) onMarch 3, 2014. Stratasys is under no obligation (and expressly disclaims any obligation) to update or alter its forward-looking statements, whether as a result of new information, future events or otherwise, except as otherwise required by the rules and regulations of the SEC.
Stratasys Media Contact
Stratasys AP Janice Lai Janice.lai@stratasys.com <mailto:Janice.lai@stratasys.com> +852-3944-8888
New Stratasys ASA Thermoplastic is UV-resistant and has Best Aesthetics among FDM 3D Printing Materials
SINGAPORE, Sept. 9, 2014 /PRNewswire/ -- Stratasys AP Ltd. <http://www.stratasys.com/>, a subsidiary of (Nasdaq:SSYS), a leading global provider of 3D printing and additive manufacturing solutions, today announced availability of a new thermoplastic material option for its FDM-based production 3D printers: ASA (Acrylonitrile Styrene Acrylate).
ASA is an all-purpose material used for the production of prototypes, manufacturing tools and finished goods. Manufacturers in the automotive, electronics, commercial, sporting goods and construction industries can benefit from ASA's UV stability, strength and durability. Applications include jigs and fixtures, electrical boxes, recreational vehicles and outdoor tools.
Compatible with the Fortus 360mc, 400mc and 900mc 3D Production Systems, ASA thermoplastic surpasses the capabilities of ABS, offering UV resistance, so parts will resist fading & remain durable with long-term exposure to direct sunlight. Â ASA offers an exceptional surface finish and has the best aesthetics of any FDM material available. Compared to ABS, details such as printed text and other features are greatly improved by ASA's matte finish.
"As 3D printing becomes a more mainstream production process, and parts are used for a longer period of time and in diverse environments, UV resistance becomes a must-have feature," explainsBrendan Dillon, product manager for Stratasys. "Once customers use ASA, they may not go back to ABS."
Easy to use, ASA is a "green-flag" material allowing Stratasys Insight software users the ability to produce parts using default settings with a single click. Available in black and ivory, ASA is compatible with existing Stratasys SR-30 support material and priced similar to ABS.
Contact a local reseller to learn more about ASA's benefits and purchasing options. Additional information about ASA including images, a brochure and material data sheet are available by visiting thenewsroom <http://www.stratasys.com/corporate/newsroom> on Stratasys' website.
Note Regarding Forward-Looking Statements
The statements in this press release relating to Stratasys' beliefs regarding the functionalities, qualities and benefits consumers will experience from our ASA (Acrylonitrile Styrene Acrylate) material are forward-looking statements reflecting management's current expectations and beliefs. These forward-looking statements are based on current information that is, by its nature, subject to rapid and even abrupt change. Due to risks and uncertainties associated with Stratasys' business, actual results could differ materially from those projected or implied by these forward-looking statements. These risks and uncertainties include, but are not limited to, the risk that consumers will not perceive the benefits of our ASA (Acrylonitrile Styrene Acrylate) to be the same as Stratasys does; and other risk factors set forth under the caption "Risk Factors" in Stratasys' most recent Annual Report on Form 20-F, filed with the Securities and Exchange Commission (SEC) onMarch 3, 2014. Stratasys is under no obligation (and expressly disclaims any obligation) to update or alter its forward-looking statements, whether as a result of new information, future events or otherwise, except as otherwise required by the rules and regulations of the SEC.
Stratasys Ltd. (Nasdaq: SSYS), headquartered in Minneapolis, Minnesota and Rehovot,Israel, is a leading global provider of 3D printing and additive and additive manufacturing solutions. The company's patented FDM® and PolyJet⢠3D Printing technologies produce prototypes and manufactured goods directly from 3D CAD files or other 3D content. Systems include 3D printers for idea development, prototyping and direct digital manufacturing. Stratasys subsidiaries include MakerBot and Solidscape, and the company operates a digital-manufacturing service comprising RedEye, Harvest Technologies and Solid Concepts. Stratasys has more than 2,500 employees, holds over 600 granted or pending additive manufacturing patents globally, and has received more than 25 awards for its technology and leadership. Online at:www.stratasys.com <http://www.stratasys.com/>  or http://blog.stratasys.com <http://blog.stratasys.com/>.
Fortus 360mc, Fortus 400mc and Fortus 900mc are trademarks, and Stratasys, Fortus and FDM are registered trademarks of Stratasys Ltd and or its subsidiaries or affiliates.
Stratasys Media ContactStratasys APJanice LaiJanice.lai@stratasys.com <mailto:Janice.lai@stratasys.com> +852-3944-8888
Stratasys triple-jetting technology is designed to allow the user to build products with up to three different materials in a single run, or even mix multiple material droplets to form new digital materials such as tough Digital ABS.
Joining the Objet500 Connex3 Color Multi-material 3D Printer <http://www.stratasys.com/3d-printers/design-series/precision/objet500-connex3> announced in January, the Objet500 Connex1 and Objet500 Connex2 offer designers and manufacturers superior versatility for materials, functionality and product realism capabilities.
Objet500 Connex1
Equipped with a large build envelope, the Objet500 Connex1 Multi-material 3D Printer can produce parts from three diverse materials in a single production run. This allows users to create assemblies with components formed from three different materials, or it can produce components that contain both rigid and flexible materials, such as rubber-like Tango and rigid Vero material. The 3D printer can build a part up to 19.3 in. x 15.4 in. x 7.9 in. (490mm x 390mm x 200mm) or a mixed tray of small parts. A larger material cabinet contains eight cartridges, resulting in more unattended run time and fewer material changeovers than previous models. Hot swapping -- or reloading material and support cartridges while the 3D printer is operating -- allows for continuous part production. Multi-material 3D printing achieves in a single, automated build what would be either impossible to achieve with conventional single-material 3D printers or would require hand assembly from multiple print jobs.
Objet500 Connex2
The Objet500 Connex2 Multi-material 3D Printer enables users to combine transparency, durability and flexibility in one part. It has all the capabilities of the Objet500 Connex1 plus the ability to combine droplets from two base materials to produce new materials or "Digital Materials." Digital ABS, for example, is the most durable material available for the Stratasys PolyJet process and is often used to produce mold cores and cavities for short-run injection molding. With more than 100 material options, Connex2 users can produce a variety of Shore A values in the same part with rigid or clear components, or can combine Digital ABS with pure Tango for strong over-molded handles and grips. The versatility of the Objet500 Connex2 also makes it ideal for creating custom manufacturing tools such as jigs and fixtures.
"Following the launch of the Objet500 Connex3 earlier this year, we saw the demand for additional multi-material 3D printers that can address a variety of applications in prototyping and manufacturing, such as tooling and molding," explains Stratasys' Senior Product Marketing ManagerRon Ellenbogen. "We were able to build on the success of our triple-jetting technology and expand the Objet500 Connex family with two 3D production systems that we believe set new standards for 3D printing price performance."
Stratasys Ltd. (Nasdaq:SSYS), headquartered in Minneapolis, Minnesota and Rehovot,Israel, is a leading global provider of 3D printing and additive manufacturing solutions. The company's patented FDM® and PolyJet⢠3D Printing technologies produce prototypes and manufactured goods directly from 3D CAD files or other 3D content. Systems include 3D printers for idea development, prototyping and direct digital manufacturing. Stratasys subsidiaries include MakerBot and Solidscape, and the company operates a digital-manufacturing service comprising RedEye, Harvest Technologies and Solid Concepts. Stratasys has more than 2,500 employees, holds over 600 granted or pending additive manufacturing patents globally, and has received more than 25 awards for its technology and leadership. Online at:www.stratasys.com <http://www.stratasys.com/> or http://blog.stratasys.com <http://blog.stratasys.com/>.
Stratasys and Objet are registered trademarks, and Objet500, Connex, PolyJet, are trademarks of Stratasys Ltd. and/or its subsidiaries or affiliates.
Note Regarding Forward-Looking Statements
The statements in this press release relating to Stratasys' beliefs regarding the capabilities and benefits consumers will experience from the Objet500 Connex1 and Objet500 Connex2 printers are forward-looking statements reflecting management's current expectations and beliefs. These forward-looking statements are based on current information that is, by its nature, subject to rapid and even abrupt change. Due to risks and uncertainties associated with Stratasys' business, actual results could differ materially from those projected or implied by these forward-looking statements. These risks and uncertainties include, but are not limited to: the risk that consumers will not perceive the benefits of the Objet500 Connex1 and Objet500 Connex2 printers to be the same as Stratasys does; the risk the Objet500 Connex1 and Objet500 Connex2 printers will not perform as expected; and other risk factors set forth under the caption "Risk Factors" in Stratasys' most recent Annual Report on Form 20-F, filed with the Securities and Exchange Commission (SEC) onMarch 3, 2014. Stratasys is under no obligation (and expressly disclaims any obligation) to update or alter its forward-looking statements, whether as a result of new information, future events or otherwise, except as otherwise required by the rules and regulations of the SEC.
Stratasys Media Contact
Stratasys AP Janice Lai Janice.lai@stratasys.com <mailto:Janice.lai@stratasys.com> +852-3944-8888
NEXCOM NSA 7130 Makes Performance and Green Pushes on Network Security
TAIPEI, Sept. 9, 2014 /PRNewswire/ -- NEXCOM has released the 2U network security appliance NSA 7130 to take on more security workloads and lower energy consumption to contribute to a greener world. Based on the Intel® Xeon® E5-2600 v3 product family (codenamed Grantley), NEXCOM NSA 7130 features enhancements in computing performance, system responsiveness, I/O throughput and hardware design to safeguard network traffic for both enterprise and telecommunication applications.
"Facing the increasing complexity and surging volume of network traffic created by Big Data and Internet of Things (IoT) applications, NEXCOM has built the NSA 7130 with the Intel® Xeon® E5-2600 v3 product family and Intel® Ethernet Controller XL710-AM2 to pave the way for next-generation networking," saidHadwin Liu, Chief Architect of NEXCOM Network and Communication Solutions Business Unit. "The NSA 7130 satisfies the need for dynamic computing and high bandwidth required of massive parallel processing and features high LAN density and modular design. The NSA 7130 is easy to scale, easy to manage, and eco-friendly, helping reduce operating expenditure for enterprises and telecom carriers."
"The Intel® Xeon® E5-2600 v3 product family delivers increased performance, energy efficiency, security, manageability, and serviceability," saidBill Rollender, director of marketing for Intel's Communications Infrastructure Division. "The Intel® Xeon® E5-2600 v3 product family will enable rapid delivery of services for high performance computing, cloud and enterprise segments and offer new opportunities for telecommunication vendors."
The NSA 7130 is a dual-socket network security appliance with support for the full range of Intel® Xeon® E5-2600 v3 product family and up to 512GB of DDR4 memory. The NSA 7130 is equipped with high speed network interfaces including four 10GbE ports, eight 1GbE copper port, and eight 1GbE fiber ports. With two third generation PCIe x8 slots and room for flexible configuration, the NSA 7130 can build on extra performance, storage, and LAN density with NEXCOM SmartNIC, LAN, and HDD modules and facilitate scaling in, scaling up, and scaling out of applications.
The power efficient design is another highlight of the NSA 7130. To reduce energy waste, the NSA 7130 uses a common redundant power supply (CRPS) module with 80 PLUS Gold certification. With a short depth of 450mm, the NSA 7130--  approximately 20 percent smaller than most popular 19-inch rackmount network appliances on the market -- can dissipate heat more easily and is suited for use in telecommunication environments.
Main Features
* Support full range of Intel® Xeon® E5-2600 v3 product family with up to 12 cores * Support up to 512GB of DDR4 2133 memory with 16 DIMM slots * Onboard 4x 10GbE LAN ports, 8x 1 GbE copper ports, 8x 1GbE fiber ports * 2x PCIe 3.0 x8 expansion slots * 2U 450mm deep rackmount form factor * Swappable 80 PLUS Gold certified Intel® CRPS module for AC/DC power inputs About NEXCOM:Founded in 1992, NEXCOM has five business units which focus on vertical markets across industrial computer, in-vehicle computer, multimedia, network and communication, and intelligent digital security industries. NEXCOM serves its customers worldwide through its subsidiaries in five major industrial countries. NEXCOM gains stronghold in vertical markets with its industry-leading products including the rugged fanless computer NISE series, the in-vehicle computer VTC series, the network and security appliance NSA series and the digital signage player NDiS series.www.nexcom.com <http://www.nexcom.com/>
Disclaimer
Intel and Xeon are registered trademarks of Intel Corporation in the United States and other countries.
Stratasys triple-jetting technology is designed to allow the user to build products with up to three different materials in a single run, or even mix multiple material droplets to form new digital materials such as tough Digital ABS.
Joining the Objet500 Connex3 Color Multi-material 3D Printer <http://www.stratasys.com/3d-printers/design-series/precision/objet500-connex3> announced in January, the Objet500 Connex1 and Objet500 Connex2 offer designers and manufacturers superior versatility for materials, functionality and product realism capabilities.
Objet500 Connex1
Equipped with a large build envelope, the Objet500 Connex1 Multi-material 3D Printer can produce parts from three diverse materials in a single production run. This allows users to create assemblies with components formed from three different materials, or it can produce components that contain both rigid and flexible materials, such as rubber-like Tango and rigid Vero material. The 3D printer can build a part up to 19.3 in. x 15.4 in. x 7.9 in. (490mm x 390mm x 200mm) or a mixed tray of small parts. A larger material cabinet contains eight cartridges, resulting in more unattended run time and fewer material changeovers than previous models. Hot swapping -- or reloading material and support cartridges while the 3D printer is operating -- allows for continuous part production. Multi-material 3D printing achieves in a single, automated build what would be either impossible to achieve with conventional single-material 3D printers or would require hand assembly from multiple print jobs.
Objet500 Connex2
The Objet500 Connex2 Multi-material 3D Printer enables users to combine transparency, durability and flexibility in one part. It has all the capabilities of the Objet500 Connex1 plus the ability to combine droplets from two base materials to produce new materials or "Digital Materials." Digital ABS, for example, is the most durable material available for the Stratasys PolyJet process and is often used to produce mold cores and cavities for short-run injection molding. With more than 100 material options, Connex2 users can produce a variety of Shore A values in the same part with rigid or clear components, or can combine Digital ABS with pure Tango for strong over-molded handles and grips. The versatility of the Objet500 Connex2 also makes it ideal for creating custom manufacturing tools such as jigs and fixtures.
"Following the launch of the Objet500 Connex3 earlier this year, we saw the demand for additional multi-material 3D printers that can address a variety of applications in prototyping and manufacturing, such as tooling and molding," explains Stratasys' Senior Product Marketing ManagerRon Ellenbogen. "We were able to build on the success of our triple-jetting technology and expand the Objet500 Connex family with two 3D production systems that we believe set new standards for 3D printing price performance."
Stratasys Ltd. (Nasdaq:SSYS), headquartered in Minneapolis, Minnesota and Rehovot,Israel, is a leading global provider of 3D printing and additive manufacturing solutions. The company's patented FDM® and PolyJet⢠3D Printing technologies produce prototypes and manufactured goods directly from 3D CAD files or other 3D content. Systems include 3D printers for idea development, prototyping and direct digital manufacturing. Stratasys subsidiaries include MakerBot and Solidscape, and the company operates a digital-manufacturing service comprising RedEye, Harvest Technologies and Solid Concepts. Stratasys has more than 2,500 employees, holds over 600 granted or pending additive manufacturing patents globally, and has received more than 25 awards for its technology and leadership. Online at: www.stratasys.com <http://www.stratasys.com/> or http://blog.stratasys.com <http://blog.stratasys.com/>.
Stratasys and Objet are registered trademarks, and Objet500, Connex, PolyJet, are trademarks of Stratasys Ltd. and/or its subsidiaries or affiliates.
Note Regarding Forward-Looking Statements
The statements in this press release relating to Stratasys' beliefs regarding the capabilities and benefits consumers will experience from the Objet500 Connex1 and Objet500 Connex2 printers are forward-looking statements reflecting management's current expectations and beliefs. These forward-looking statements are based on current information that is, by its nature, subject to rapid and even abrupt change. Due to risks and uncertainties associated with Stratasys' business, actual results could differ materially from those projected or implied by these forward-looking statements. These risks and uncertainties include, but are not limited to: the risk that consumers will not perceive the benefits of the Objet500 Connex1 and Objet500 Connex2 printers to be the same as Stratasys does; the risk the Objet500 Connex1 and Objet500 Connex2 printers will not perform as expected; and other risk factors set forth under the caption "Risk Factors" in Stratasys' most recent Annual Report on Form 20-F, filed with the Securities and Exchange Commission (SEC) onMarch 3, 2014. Stratasys is under no obligation (and expressly disclaims any obligation) to update or alter its forward-looking statements, whether as a result of new information, future events or otherwise, except as otherwise required by the rules and regulations of the SEC.
Stratasys Media ContactStratasys APJanice LaiJanice.lai@stratasys.com <mailto:Janice.lai@stratasys.com> +852-3944-8888
New Stratasys ASA Thermoplastic is UV-Resistant and has Best Aesthetics among FDM 3D Printing Materials
MELBOURNE, Australia, Sept. 9, 2014 /PRNewswire/ -- Stratasys AP Ltd. <http://www.stratasys.com/>, a subsidiary of (Nasdaq:SSYS), a leading global provider of 3D printing and additive manufacturing solutions, today announced availability of a new thermoplastic material option for its FDM-based production 3D printers: ASA (Acrylonitrile Styrene Acrylate).
ASA is an all-purpose material used for the production of prototypes, manufacturing tools and finished goods. Manufacturers in the automotive, electronics, commercial, sporting goods and construction industries can benefit from ASA's UV stability, strength and durability. Applications include jigs and fixtures, electrical boxes, recreational vehicles and outdoor tools.
Compatible with the Fortus 360mc, 400mc and 900mc 3D Production Systems, ASA thermoplastic surpasses the capabilities of ABS, offering UV resistance, so parts will resist fading & remain durable with long-term exposure to direct sunlight. Â ASA offers an exceptional surface finish and has the best aesthetics of any FDM material available. Compared to ABS, details such as printed text and other features are greatly improved by ASA's matte finish.
"As 3D printing becomes a more mainstream production process, and parts are used for a longer period of time and in diverse environments, UV resistance becomes a must-have feature," explainsBrendan Dillon, product manager for Stratasys. "Once customers use ASA, they may not go back to ABS."
Easy to use, ASA is a "green-flag" material allowing Stratasys Insight software users the ability to produce parts using default settings with a single click. Available in black and ivory, ASA is compatible with existing Stratasys SR-30 support material and priced similar to ABS.
Contact a local reseller to learn more about ASA's benefits and purchasing options. Additional information about ASA including images, a brochure and material data sheet are available by visiting thenewsroom <http://www.stratasys.com/corporate/newsroom> on Stratasys' website.
Note Regarding Forward-Looking Statements
The statements in this press release relating to Stratasys' beliefs regarding the functionalities, qualities and benefits consumers will experience from our ASA (Acrylonitrile Styrene Acrylate) material are forward-looking statements reflecting management's current expectations and beliefs. These forward-looking statements are based on current information that is, by its nature, subject to rapid and even abrupt change. Due to risks and uncertainties associated with Stratasys' business, actual results could differ materially from those projected or implied by these forward-looking statements. These risks and uncertainties include, but are not limited to, the risk that consumers will not perceive the benefits of our ASA (Acrylonitrile Styrene Acrylate) to be the same as Stratasys does; and other risk factors set forth under the caption "Risk Factors" in Stratasys' most recent Annual Report on Form 20-F, filed with the Securities and Exchange Commission (SEC) onMarch 3, 2014. Stratasys is under no obligation (and expressly disclaims any obligation) to update or alter its forward-looking statements, whether as a result of new information, future events or otherwise, except as otherwise required by the rules and regulations of the SEC.
Stratasys Ltd. (Nasdaq: SSYS), headquartered in Minneapolis, Minnesota and Rehovot,Israel, is a leading global provider of 3D printing and additive and additive manufacturing solutions. The company's patented FDM® and PolyJet⢠3D Printing technologies produce prototypes and manufactured goods directly from 3D CAD files or other 3D content. Systems include 3D printers for idea development, prototyping and direct digital manufacturing. Stratasys subsidiaries include MakerBot and Solidscape, and the company operates a digital-manufacturing service comprising RedEye, Harvest Technologies and Solid Concepts. Stratasys has more than 2,500 employees, holds over 600 granted or pending additive manufacturing patents globally, and has received more than 25 awards for its technology and leadership. Online at:www.stratasys.com <http://www.stratasys.com/> or http://blog.stratasys.com <http://blog.stratasys.com/>.
Fortus 360mc, Fortus 400mc and Fortus 900mc are trademarks, and Stratasys, Fortus and FDM are registered trademarks of Stratasys Ltd and or its subsidiaries or affiliates.
Stratasys Media ContactStratasys APJanice LaiJanice.lai@stratasys.com <mailto:Janice.lai@stratasys.com> +852-3944-8888
Supermicro® Releases X10 Server Solutions Featuring New Intel® Xeon® Processor E5-2600/1600 v3, DDR4 and NVMe at IDF 2014
SAN FRANCISCO, Sept. 9, 2014 /PRNewswire/ -- Super Micro Computer, Inc. (NASDAQ: SMCI), a global leader in high-performance, high-efficiency server, storage technology and green computing releases its most comprehensive line of X10 Server Building Block Solutions featuring the new Intel® Xeon® processor E5-2600/1600 v3 family formerly codenamed Haswell this week at the Intel Developer Forum (IDF) 2014 inSan Francisco, California. Taking the spotlight at the show will be Supermicro's new 1U/2U Ultra SuperServer® solutions which deliver ultimate performance with the latest Intel® Xeon® processor E5-2600 v3 (up to 18 Cores, up to 160W), up to 1.5TB of DDR4 2133MHz Reg. ECC memory in 24x DIMMs and Intel® Xeon® Phi⢠coprocessor support. The new flexible/scalable Ultra architecture also supports hot-swappable NVMe storage, 12Gb/s SAS3 with hardware RAID, dual or quad port 1G, 10GBASE-T, 10G SFP+, 40G Ethernet InfiniBand options and up to four PCI-E 3.0 Add-on-Cards (AoC) in 1U or up to eight AoCs in 2U. In addition, these highly configurable solutions feature Supermicro's new Titanium level high-efficiency (96%+) Digital power supplies which reduce power consumption and contribute to maximized performance per watt, per square foot, per dollar. Supermicro's extensive X10 lineup also includes dual-processor (DP) and uni-processor (UP) solutions available across TwinProâ¢, MicroBlade, FatTwinâ¢, SuperBlade®, Data Center Optimized (DCO), WIO, Intel® Xeon® Phi⢠coprocessor, Mainstream, SuperStorage, SuperWorkstation platforms and a wide range of DP/UP motherboards.
"Supermicro's X10 Green Computing solutions offer the most optimized DP/UP server and storage platforms on the market supporting advanced technologies and new Intel Xeon E5-2600/1600 v3 processors," saidCharles Liang, President and CEO of Supermicro. "Leading the wave is our new 1U/2U Ultra SuperServers which integrate hot-swap NVMe SSDs and SAS3 storage with high bandwidth 10G/40G networking in a new thermal optimized architecture that minimizes fan count and fan power consumption to provide exactly the best platform for enterprise-class virtualization and hyper-scale computing applications. Combined with our new X10 TwinPro, MicroBlade and FatTwin systems as well as the industry's widest range of server building blocks with Titanium level high efficiency power supplies, Supermicro is delivering total solutions to address the critical power, space and cost challenges facing today's data driven businesses."
"The new Intel Xeon processor E5-2600/1600 v3 product families provide solution partners such as Supermicro with the optimized performance and power efficiency required to address the most critical challenges facing next generation data center, cloud and hyperscale environments," saidShannon Poulin, vice president, Data Center Group, Intel. "Together with Supermicro's diverse range of green server and storage solutions, we're helping customers to re-architect the data center for the digital services era."
IDF 2014 X10 Solution Highlights
* 1U/2U Ultra <http://www.supermicro.com/Ultra> SuperServer â The Ultra platform offers best-in-class Enterprise server performance while maximizing value and delivering uncompromising flexibility, scalability, and manageability. Hyper-Speed Ultra adds unparalleled performance and is optimized for applications such as Low-Latency trading. Depending on configuration, systems feature dual Intel® Xeon® processor E5-2600 v3 (up to 18 cores, up to 160W TDP), 24x/16x DIMMs up to 1.5TB/1TB of DDR4 2133MHz Reg. ECC memory, hot-swap NVMe and 12Gb/s SAS3 options up to 8x PCI-E 3.0 expansion slots, dual or quad port 1G, 10GBASE-T, 10G SFP+, 40G Ethernet, and InfiniBand options and 750W/1000W Redundant Titanium Level high-efficiency (96%+) Digital Power Supplies * 6U MicroBlade <http://www.supermicro.com/MicroBlade> â High-performance, high-density server featuring 28x hot-swappable MicroBlade modules supporting dual Intel® Xeon® E5-2600 v3 (up to 14 cores, 120W TDP) or E3-1200 v3, up to 196x DP nodes per 42U Rack with up to 128GB in 8x VLP DDR4 2133MHz DIMMs and 2x 2.5" 6Gb/s SATA3 HDD/SSDs and 1xSATA DOM per module. MicroBlade enclosure incorporates up to 2x Chassis Management Module (CMM) and up to 2x hot-swappable network switches with 2x 40Gb/s QSFP or 8x 10Gb/s SFP+ uplinks per module. Enclosure also features up to 8x redundant (N+1 or N+N) 1600W Platinum Level high-efficiency (95%+) Digital power supplies with cooling fans. Ideal for cloud computing, data center, enterprise, high performance computing, dedicated hosting and content delivery applications. * 2U TwinProâ¢/ TwinPro²⢠<http://www.supermicro.com/products/nfo/Xeon_X10_E5.cfm?pg=SS&show=SELECT&type=TWIN> (SYS-2028TP/6028TP -D/-H Series) - 2U/4U hot-plug node servers supporting dual Intel® Xeon® processor E5-2600 v3 (up to 18 cores, 145W TDP), up to 1TB of DDR4 2133MHz Reg. ECC memory in 16x R/LR DIMMs, PCI-E 3.0 and PCI-E 3.0 x16 "0" slot, Intel® Xeon® Phi⢠support, 8x ports of Avago 3008/3108 SAS 3.0 (12Gb/s) with optional SuperCap (CacheVault), 8x ports of SATA 3.0 (6Gbps), up to 4x NVMe, single FDR (56Gb/s) InfiniBand, dual 10GBase-T and 1280W Redundant Platinum Level high-efficiency (95%+) Digital Power Supplies * 4U FatTwin⢠<http://www.supermicro.com/products/nfo/Xeon_X10_E5.cfm?pg=SS&show=SELECT&type=FatTwin> - High-density 8/4/2 hot-plug node SuperServer® systems available with a variety of memory capacities, HDD technologies, PCI-E alternatives, networking capabilities, and Intel® Xeon® Phi⢠support options. Systems support dual Intel® Xeon® processor E5-2600 v3 (up to 18 cores and 145W TDP) up to 1TB of DDR4 2133MHz Reg. ECC in 16x DIMMs, 1x PCI-E 3.0 x16 and 1x PCI-E 3.0 x8 Micro LP card, 8x ports of LSI® 3008/3108 SAS 3.0 (12Gbps) with software/hardware RAID, 10x ports of SATA 3.0 (6Gbps) with Intel® C612 controller, dual 10GBase-T or dual GbE ports, redundant Titanium Level (96%+) Digital power supplies, integrated IPMI 2.0 with KVM over dedicated LAN * 7U SuperBlade® <http://www.supermicro.com/products/nfo/Xeon_X10_E5.cfm?pg=SB> â TwinBlade® (SBI-7228R-T2F/-T2X, CPUs 145W TDP), Datacenter Blade (SBI-7428R-C3/-T3, CPUs 145W TDP) and StorageBlade (SBI-7128R-C6, CPUs 160W TDP) modules support dual Intel® Xeon® processors E5-2600 v3 (up to 18 cores) per node, optional InfiniBand or 10G mezzanine HCA, optional PCI-E 3.0 expansion card, support for NVMe or 12Gb/s SAS3 (StorageBlade/Datacenter Blade) and Platinum Level high-efficiency (94%+), N+1 redundant power supplies * 1U/2U Data Center Optimized <http://www.supermicro.com/products/nfo/Xeon_X10_E5.cfm?pg=SS&show=SELECT&type=DCO> (DCO) Solutions â Enhanced thermal architecture featuring power efficient components and offset processors eliminate CPU preheating allowing higher operating temperatures. Supports dual Intel® Xeon® processor E5-2600 v3 (up to 18 cores and 145W TDP), up to 1TB DDR4 2133MHz memory in 16x DIMM slots, 4x AoC option including SAS mezzanine card, 10x SATA 3.0 (6Gbps) ports with Intel® C612 controller, up to 2x GbE LAN, 4x internal NVMe ports, and 7+ year product life cycle with Platinum level (95%+) high-efficiency Digital power supplies * 1U/2U WIO <http://www.supermicro.com/products/nfo/Xeon_X10_E5.cfm?pg=SS&show=SELECT&type=WIO> SuperServer Solutions â Wide range of I/O options to optimize the storage and networking alternatives for General Purpose, ERP/MRP, and Network and Security Appliance Applications. Supports dual or single Intel® Xeon® processor E5-2600/1600 v3 (up to 18 cores, 145W TDP), up to 1TB of DDR4 2133MHz in 16x DIMMs, 2/6x Add-on Cards (AOC) in 1U/2U, 10x SATA 3.0 (6Gbps) ports with Intel® C612 controller, optional NVMe and 12Gb/s SAS3 support, LAN options up to 2x 10GBase-T or 2x GbE ports, redundant Platinum Level high-efficiency (95%+) Digital power supplies, integrated IPMI 2.0 with KVM over dedicated LAN * 1U/2U/4U/Tower GPU/Intel® Xeon® Phi⢠<http://www.supermicro.com/products/nfo/Xeon_X10_E5.cfm?pg=SS&show=SELECT&type=GPU> Solutions â support dual Intel® Xeon® processors E5-2600 v3 (up to 18 cores, 145W TDP) per node up to 1TB of DDR4 2133MHz memory in 16x DIMMs, 4/6x Intel® Xeon Phi⢠coprocessors in 1U/2U, 10 SATA 3.0 (6Gbps) ports with Intel® C612 controller, LAN options up to 2x 10GBase-T or 2 GbE ports, redundant Platinum Level high-efficiency (95%+) Digital power supplies, integrated IPMI 2.0 with KVM over dedicated LAN * 1U/2U/4U/Tower Mainstream <http://www.supermicro.com/products/nfo/Xeon_X10_E5.cfm?pg=SS&show=SELECT&type=MS> SuperServer Solutions â Entry level or volume solutions for Enterprise IT, optimized to save significant amounts on CAPEX/OPEX. Supports dual or single Intel® Xeon® processor E5-2600/1600 v3 (up to 18 cores,145W TDP), up to 1TB of DDR4 2133MHz Reg. ECC in 16x DIMMs, 6x PCI-E (3x PCI-E 3.0 x8 in x16, 3x PCI-E 3.0 x8) slots, 10x SATA 3.0 (6Gbps) ports with Intel® C612 controller, LAN supports 2x 10GBase-T or 2x GbE ports and redundant Platinum Level high-efficiency (94%+) Digital power supplies * 2U/4U SuperStorage <http://www.supermicro.com/products/nfo/Xeon_X10_E5.cfm?pg=SS&show=SELECT&type=SSG> â From low-latency SSD applications to the massive capacity needed for large media files, these systems support node based deployment strategies where CPU and HDD capacity scale together, or deployments can be expanded using JBODs for improved economy. Supports single Intel® Xeon® processor E5-2600/1600 v3 (up to 18 cores,145W TDP), up to 512GB of DDR4 2133MHz Reg. ECC in 8x DIMMs, 12x 3.5" Hot-swap SAS3 HDD Bays (SAS3 via onboard Avago Technologies 3008 to SAS3 backplane) (SSG-5028R-E1CR12L) or 36x 3.5" Hot-swap SAS3 HDD Bays (SAS3 via onboard Avago Technologies 3008 to SAS3 backplane); optional 2x rear 2.5" Hot-swap HDD Bays (SSG-5048R-E1CR36L) * 4U/Tower SuperWorkstations <http://www.supermicro.com/products/nfo/Xeon_X10_E5.cfm?pg=SS&show=SELECT&type=SW> â Server grade SuperWorkstations support up to: 1TB of DDR4-2133MHz memory in 16 DIMM slots, 6x PCI-E 3.0 slots including 3x PCI-E 3.0 x16 slots for GPU/Intel® Xeon® Phi⢠coprocessors, 8x ports of Avago Technologies 3008 SAS3 (12Gb/s) with software RAID, and dual GbE LAN ports. Workstations also feature 7.1 HD audio, 11 USB ports (6 USB 3.0), SLI, Thunderbolt 2.0 AoC, Hyper-Speed hardware acceleration, 7+ year product life cycle and 160W CPU support. * DP/UP Motherboards <http://www.supermicro.com/products/nfo/Xeon_X10_E5.cfm?pg=MB&show=SELECT&Socket=R3> - X10 motherboards, the basis of Supermicro's Server Building Blocks are available in dual-processor (DP) and uni-processor (UP) server and SuperWorkstation configurations supporting the new Intel® Xeon® processor E5-2600/1600 v3 product family. DP/UP motherboards also feature advanced technologies including DDR4 2133MHz memory, hot-swap NVMe, 12Gb/s SAS3, 10GBase-T/10G SFP+/56Gbps FDR IB networking options, SATA Disk-on-Module (DOM), Thunderbolt 2.0 are offered in a variety of form factors, including ATX, E. ATX, E.E. ATX. (DP) X10DRC-T4+, X10DRC-LN4+, X10DRi-T4+, X10DRi-LN4+, X10DRi/-T, X10DRW-i/-iT, X10DDW-i, X10DDW-iN, X10DRG-Q, X10DRL-I, X10DAi, X10DAC, X10DAX; (UP) X10SRL-F, X10SRi-F, X10SRW-F, X10SRH-CF, C7X99-OCE Supermicro will also debut its new compact Internet-of-Things (IoT) Gateway (SYS-E100-8Q <http://www.supermicro.com/products/system/Compact/IoT/SYS-E100-8Q.cfm>) featuring a 4.1"x4" ultra-low power motherboard (MBD-A1SQN <http://www.supermicro.com/products/motherboard/Quark/A1SQN.cfm>) supporting Intel® Quark X1021 (2.2W TDP) SoC, onboard 512MB DDR3 ECC memory, 1x Micro SDHC up to 32GB, 2x Mini-PCI-E slots, 1x ZigBee module socket, TPM 1.2, 2x 10/100Mbps RJ45, 1x RS-232 via DB9, 1x RS485 via screw terminal interface, 2x USB 2.0 (device & host), 1x Analog Input 8 channel 12-bit and 1x DIO. This new compact low-power system is optimized for embedded applications such as Smart Building/Home Gateway, Retail store or Warehouse Hub and Smart Factory IoT Gateways.
Visit Supermicro at IDF 2014 in San Francisco, California this week, September 9th through the 11th in Moscone Center West; Main Booth #700, NVMe Booth #975, Embedded/IoT Booth #168. For more information on Supermicro's X10 solutions visitwww.supermicro.com/X10 <http://www.supermicro.com/X10>. For Supermicro's complete range of high performance, high-efficiency Server, Storage, Networking and Management solutions, visit www.supermicro.com <http://www.supermicro.com/>.
About Super Micro Computer, Inc. Supermicro® (NASDAQ: SMCI), the leading innovator in high-performance, high-efficiency server technology is a premier provider of advanced server Building Block Solutions® for Data Center, Cloud Computing, Enterprise IT, Hadoop/Big Data, HPC and Embedded Systems worldwide. Supermicro is committed to protecting the environment through its "We Keep IT Green®" initiative and provides customers with the most energy-efficient, environmentally-friendly solutions available on the market.
Supermicro, Building Block Solutions and We Keep IT Green are trademarks and/or registered trademarks of Super Micro Computer, Inc.
Intel and Xeon are registered trademarks of Intel Corporation in the United States and other countries.
All other brands, names and trademarks are the property of their respective owners.
Maxta Delivers the First Hyper-Converged Solution to Run on Intel® Xeon® processor E5-2600 v3 as a New MaxDeploy(TM) Reference Architecture
New Release of MxSP Software-Defined Storage Solution Delivers Significant Improvements Over Previous Generation of Processors and Includes Enhanced Functionality
SUNNYVALE, Calif., Sept. 8, 2014 /PRNewswire/ -- Maxta, a leader in hyper-convergence and software-defined storage, today announced a new MaxDeploy(TM) Reference Architecture that is the first hyper-converged solution to run on the new Intel® Xeon® processor E5-2600 v3 family, along with significant updates to its MxSP software. The new release of MxSP is the first software-define storage solution to leverage the new server platform, with its improved speed, higher number of cores, NVMe storage interface, DDR4 memory, and 40GbE support. The new MxSP running on the Xeon processor-based platform will be demonstrated for the first time at the Intel Developer Forum (IDF) on September 9, 2014 at Moscone Center West, San Francisco, Booth #118.
Maxta's innovative software-defined storage continues to deliver on the promise of hyper-convergence by providing greater choice, flexibility and savings while running on standard x86 servers. The Intel Xeon processor E5-2600 v3 running Maxta MxSP software helps accelerate this trend, delivering superior performance for hyper-converged environments. Performance testing shows that MxSP running on the new Xeon E5 processor increases VM density and storage performance for VMs in virtualized environments. In application-level testing, MxSP demonstrated support of 40% more Microsoft® Exchange® users than when ran on prior generations of Intel Xeon processors.
New MxSP features provide improved VM-centric automation, simplified data protection, greater availability and resiliency with support for VMware Stretch Storage Metro Cluster for continuous availability in case of site, data center or rack failure, along with improved self-healing capabilities to detect and auto-correct inconsistencies in data. Performance enhancements include improved caching algorithms and improved flash utilization to deliver consistent and predictable latency.
MaxDeploy Hyper-Convergence Reference Architectures provide customers a repeatable and standard deployment model, ease of ordering, and predictability of interoperability and performance. MaxDeploy running on the Intel Xeon Processor E5-2600 v3 provides significant improvements over the previous generation of x86 servers in the number of I/O transactions per second, read and write latency, and the number of Virtual Machines deployed on a server. Additionally, MaxDeploy demonstrates the agility of MxSP by providing unprecedented time to market and the ability to narrow the gap between the availability of a new x86 platform and the availability of a hyper-converged solution running on the new platform.
The Intel Solid-State Drive Data Center Family for PCIe is configured as part of this MaxDeploy Reference Architecture, providing high-performance caching using the NVMe interface as part of MxSP's improved flash utilization. The Intel Ethernet Controller XL710 10/40GbE can also be configured as part of the solution to support high I/O workloads and/or a large number of nodes. By using MaxDeploy with the Intel Xeon Processor E5-2600 v3 family, Intel Solid-State Drive Data Center Family, and Intel Ethernet Controller XL710, enterprises now have the flexibility to scale their environment on-demand without over provisioning resources.
Tweet this: @Maxtainc announces first #hyperconvergence solution to run on new @Intel Xeon processor E5-2600 v3 family and adds additional performance, scale, and resiliency
Tweet this: @Intel Xeon E5-2600 v3 processor & @Maxtainc MxSP sw provide superior performance for @hyperconvergence. Supports 40% more Exchange users than prior generations.
Quotes
"The enhancements to MxSP deliver more capabilities and performance than ever before to the virtual data center," said Yoram Novick, Maxta founder, president and CEO. "With the ability to deliver best-in-class compute and storage technology on the latest standard, Intel-based servers, Maxta is able to maximize the promise of hyper-convergence with the greatest levels of choice, simplicity, and agility to meet market demands."
Yoram Novick, CEO Maxta, Inc.
"Pre-validated configurations are beneficial to customers in reducing risk and the investment required in time and resources to implement a solution, while increasing the predictability of success," said Bev Crair, General Manager for Intel's Storage Division. "Maxta's tested Reference Architecture on the latest Intel Xeon processors, Intel SSDs and Intel Ethernet controllers, will help provide a time-to-market and performance advantage for enterprise customers implementing hyper-converged solutions."
Bev Crair, General Manager, Storage Division, Intel Corporation
"The MaxDeploy Reference Architecture running on the new Intel Xeon processor turns MaxDeploy into the most powerful hyper-converged solution on the market," said Greg White, CEO of Clearmatter. "The ability to immediately leverage the speed and agility of Intel's latest processors with a validated software-defined storage solution from Maxta means that I gain a time-to-market competitive advantage along with increased performance and savings."
Greg White, CEO, Clearmatter
"Enterprise-class, virtual machine level data services are not typically available in legacy storage architectures and are only slowly becoming available in hypervisor-specific storage platforms," said David Floyer, Co-founder and CTO, Wikibon Project. "The pre-validated approach such as the MaxDeploy Reference Architecture, along with Maxta MxSP software, assists organizations to deploy predictable, repeatable and scalable IT infrastructure. The Maxta partnership with Intel is a key asset in offering converged Server SAN solutions in both enterprise and hyper-converged deployments."
Dave Floyer, Co-founder and CTO Wikibon
MaxDeploy Reference Architectures enable users to quickly build hyper-converged solutions for the virtual data center based on their choice of hardware vendors. It offers predefined, validated configurations including common server platforms, storage media types and capacities and network switches. This eliminates compatibility issues, simplifies and shortens installation time and training, and helps organizations meet end user application and performance demands immediately.
Unlike other platforms on the market, MxSP is hypervisor-agnostic and includes features required in virtual environments such as end-to-end data integrity, efficient snapshots and cloning, and compression/deduplication for capacity optimization. Its simplified data protection options include an automated scheduler for snapshot management, predefined retention policies, and simple recovery. An enhanced dashboard displays performance and capacity information in real time.
Resources
-- MaxDeploy Reference Architecture
-- State of the Hyper-Convergence Market
Follow Maxta on Twitter, LinkedIn and Facebook
About Maxta
Maxta maximizes the promise of hyper-convergence. Maxta software-defined storage solutions provide organizations the choice to deploy hyper-convergence on any x86 server, use any hypervisor and any combination of storage devices. The simplicity of Maxta's VM-centric solution reduces IT management to further maximize cost savings. Hyper-scale, enterprise-level data services and capacity optimization, empower organizations to hyper-converge, eliminating the need for SAN or NAS devices. Think outside the storage box. For more information, visit http://www.maxta.com.
Intel and Xeon are registered trademarks of Intel Corporation in the United States and other countries. Others are trademarks or trade names of their respective owners.
Supermicro® Releases X10 Server Solutions Featuring New Intel® Xeon® Processor E5-2600/1600 v3, DDR4 and NVMe at IDF 2014
New Server Solutions Maximize Performance, Density and Efficiency with 18-Core CPUs, Latest Technology Integration and Titanium Level High-Efficiency (96%+) Digital Power Supplies
SAN FRANCISCO, Sept. 8, 2014 /PRNewswire/ -- Super Micro Computer, Inc. (NASDAQ: SMCI), a global leader in high-performance, high-efficiency server, storage technology and green computing releases its most comprehensive line of X10 Server Building Block Solutions featuring the new Intel® Xeon® processor E5-2600/1600 v3 family formerly codenamed Haswell this week at the Intel Developer Forum (IDF) 2014 in San Francisco, California. Taking the spotlight at the show will be Supermicro's new 1U/2U Ultra SuperServer® solutions which deliver ultimate performance with the latest Intel® Xeon® processor E5-2600 v3 (up to 18 Cores, up to 160W), up to 1.5TB of DDR4 2133MHz Reg. ECC memory in 24x DIMMs and Intel® Xeon® Phi(TM) coprocessor support. The new flexible/scalable Ultra architecture also supports hot-swappable NVMe storage, 12Gb/s SAS3 with hardware RAID, dual or quad port 1G, 10GBASE-T, 10G SFP+, 40G Ethernet InfiniBand options and up to four PCI-E 3.0 Add-on-Cards (AoC) in 1U or up to eight AoCs in 2U. In addition, these highly configurable solutions feature Supermicro's new Titanium level high-efficiency (96%+) Digital power supplies which reduce power consumption and contribute to maximized performance per watt, per square foot, per dollar. Supermicro's extensive X10 lineup also includes dual-processor (DP) and uni-processor (UP) solutions available across TwinPro(TM), MicroBlade, FatTwin(TM), SuperBlade®, Data Center Optimized (DCO), WIO, Intel® Xeon® Phi(TM) coprocessor, Mainstream, SuperStorage, SuperWorkstation platforms and a wide range of DP/UP motherboards.
"Supermicro's X10 Green Computing solutions offer the most optimized DP/UP server and storage platforms on the market supporting advanced technologies and new Intel Xeon E5-2600/1600 v3 processors," said Charles Liang, President and CEO of Supermicro. "Leading the wave is our new 1U/2U Ultra SuperServers which integrate hot-swap NVMe SSDs and SAS3 storage with high bandwidth 10G/40G networking in a new thermal optimized architecture that minimizes fan count and fan power consumption to provide exactly the best platform for enterprise-class virtualization and hyper-scale computing applications. Combined with our new X10 TwinPro, MicroBlade and FatTwin systems as well as the industry's widest range of server building blocks with Titanium level high efficiency power supplies, Supermicro is delivering total solutions to address the critical power, space and cost challenges facing today's data driven businesses."
"The new Intel Xeon processor E5-2600/1600 v3 product families provide solution partners such as Supermicro with the optimized performance and power efficiency required to address the most critical challenges facing next generation data center, cloud and hyperscale environments," said Shannon Poulin, vice president, Data Center Group, Intel. "Together with Supermicro's diverse range of green server and storage solutions, we're helping customers to re-architect the data center for the digital services era."
IDF 2014 X10 Solution Highlights
-- 1U/2U Ultra SuperServer - The Ultra platform offers best-in-class
Enterprise server performance while maximizing value and delivering
uncompromising flexibility, scalability, and manageability. Hyper-Speed
Ultra adds unparalleled performance and is optimized for applications
such as Low-Latency trading. Depending on configuration, systems
feature dual Intel® Xeon® processor E5-2600 v3 (up to 18 cores, up to
160W TDP), 24x/16x DIMMs up to 1.5TB/1TB of DDR4 2133MHz Reg. ECC
memory, hot-swap NVMe and 12Gb/s SAS3 options up to 8x PCI-E 3.0
expansion slots, dual or quad port 1G, 10GBASE-T, 10G SFP+, 40G
Ethernet, and InfiniBand options and 750W/1000W Redundant Titanium Level
high-efficiency (96%+) Digital Power Supplies
-- 6U MicroBlade - High-performance, high-density server featuring 28x
hot-swappable MicroBlade modules supporting dual Intel® Xeon® E5-2600
v3 (up to 14 cores, 120W TDP) or E3-1200 v3, up to 196x DP nodes per 42U
Rack with up to 128GB in 8x VLP DDR4 2133MHz DIMMs and 2x 2.5" 6Gb/s
SATA3 HDD/SSDs and 1x SATA DOM per module. MicroBlade enclosure
incorporates up to 2x Chassis Management Module (CMM) and up to 2x
hot-swappable network switches with 2x 40Gb/s QSFP or 8x 10Gb/s SFP+
uplinks per module. Enclosure also features up to 8x redundant (N+1 or
N+N) 1600W Platinum Level high-efficiency (95%+) Digital power supplies
with cooling fans. Ideal for cloud computing, data center, enterprise,
high performance computing, dedicated hosting and content delivery
applications.
-- 2U TwinPro(TM)/ TwinPro²(TM) (SYS-2028TP/6028TP -D/-H Series) - 2U/4U
hot-plug node servers supporting dual Intel® Xeon® processor E5-2600
v3 (up to 18 cores, 145W TDP), up to 1TB of DDR4 2133MHz Reg. ECC memory
in 16x R/LR DIMMs, PCI-E 3.0 and PCI-E 3.0 x16 "0" slot, Intel® Xeon®
Phi(TM) support, 8x ports of Avago 3008/3108 SAS 3.0 (12Gb/s) with
optional SuperCap (CacheVault), 8x ports of SATA 3.0 (6Gbps), up to 4x
NVMe, single FDR (56Gb/s) InfiniBand, dual 10GBase-T and 1280W Redundant
Platinum Level high-efficiency (95%+) Digital Power Supplies
-- 4U FatTwin(TM) - High-density 8/4/2 hot-plug node SuperServer® systems
available with a variety of memory capacities, HDD technologies, PCI-E
alternatives, networking capabilities, and Intel® Xeon® Phi(TM)
support options. Systems support dual Intel® Xeon® processor E5-2600
v3 (up to 18 cores and 145W TDP) up to 1TB of DDR4 2133MHz Reg. ECC in
16x DIMMs, 1x PCI-E 3.0 x16 and 1x PCI-E 3.0 x8 Micro LP card, 8x ports
of LSI® 3008/3108 SAS 3.0 (12Gbps) with software/hardware RAID, 10x
ports of SATA 3.0 (6Gbps) with Intel® C612 controller, dual 10GBase-T
or dual GbE ports, redundant Titanium Level (96%+) Digital power
supplies, integrated IPMI 2.0 with KVM over dedicated LAN
-- 7U SuperBlade® - TwinBlade® (SBI-7228R-T2F/-T2X, CPUs 145W TDP),
Datacenter Blade (SBI-7428R-C3/-T3, CPUs 145W TDP) and StorageBlade
(SBI-7128R-C6, CPUs 160W TDP) modules support dual Intel® Xeon®
processors E5-2600 v3 (up to 18 cores) per node, optional InfiniBand or
10G mezzanine HCA, optional PCI-E 3.0 expansion card, support for NVMe
or 12Gb/s SAS3 (StorageBlade/Datacenter Blade) and Platinum Level
high-efficiency (94%+), N+1 redundant power supplies
-- 1U/2U Data Center Optimized (DCO) Solutions - Enhanced thermal
architecture featuring power efficient components and offset processors
eliminate CPU preheating allowing higher operating temperatures.
Supports dual Intel® Xeon® processor E5-2600 v3 (up to 18 cores and
145W TDP), up to 1TB DDR4 2133MHz memory in 16x DIMM slots, 4x AoC
option including SAS mezzanine card, 10x SATA 3.0 (6Gbps) ports with
Intel® C612 controller, up to 2x GbE LAN, 4x internal NVMe ports, and
7+ year product life cycle with Platinum level (95%+) high-efficiency
Digital power supplies
-- 1U/2U WIO SuperServer Solutions - Wide range of I/O options to optimize
the storage and networking alternatives for General Purpose, ERP/MRP,
and Network and Security Appliance Applications. Supports dual or single
Intel® Xeon® processor E5-2600/1600 v3 (up to 18 cores, 145W TDP), up
to 1TB of DDR4 2133MHz in 16x DIMMs, 2/6x Add-on Cards (AOC) in 1U/2U,
10x SATA 3.0 (6Gbps) ports with Intel® C612 controller, optional NVMe
and 12Gb/s SAS3 support, LAN options up to 2x 10GBase-T or 2x GbE ports,
redundant Platinum Level high-efficiency (95%+) Digital power supplies,
integrated IPMI 2.0 with KVM over dedicated LAN
-- 1U/2U/4U/Tower GPU/Intel® Xeon® Phi(TM) Solutions - support dual
Intel® Xeon® processors E5-2600 v3 (up to 18 cores, 145W TDP) per node
up to 1TB of DDR4 2133MHz memory in 16x DIMMs, 4/6x Intel® Xeon Phi(TM)
coprocessors in 1U/2U, 10 SATA 3.0 (6Gbps) ports with Intel® C612
controller, LAN options up to 2x 10GBase-T or 2 GbE ports, redundant
Platinum Level high-efficiency (95%+) Digital power supplies, integrated
IPMI 2.0 with KVM over dedicated LAN
-- 1U/2U/4U/Tower Mainstream SuperServer Solutions - Entry level or volume
solutions for Enterprise IT, optimized to save significant amounts on
CAPEX/OPEX. Supports dual or single Intel® Xeon® processor
E5-2600/1600 v3 (up to 18 cores,145W TDP), up to 1TB of DDR4 2133MHz
Reg. ECC in 16x DIMMs, 6x PCI-E (3x PCI-E 3.0 x8 in x16, 3x PCI-E 3.0
x8) slots, 10x SATA 3.0 (6Gbps) ports with Intel® C612 controller, LAN
supports 2x 10GBase-T or 2x GbE ports and redundant Platinum Level
high-efficiency (94%+) Digital power supplies
-- 2U/4U SuperStorage - From low-latency SSD applications to the massive
capacity needed for large media files, these systems support node based
deployment strategies where CPU and HDD capacity scale together, or
deployments can be expanded using JBODs for improved economy. Supports
single Intel® Xeon® processor E5-2600/1600 v3 (up to 18 cores,145W
TDP), up to 512GB of DDR4 2133MHz Reg. ECC in 8x DIMMs, 12x 3.5"
Hot-swap SAS3 HDD Bays (SAS3 via onboard Avago Technologies 3008 to SAS3
backplane) (SSG-5028R-E1CR12L) or 36x 3.5" Hot-swap SAS3 HDD Bays (SAS3
via onboard Avago Technologies 3008 to SAS3 backplane); optional 2x rear
2.5" Hot-swap HDD Bays (SSG-5048R-E1CR36L)
-- 4U/Tower SuperWorkstations - Server grade SuperWorkstations support up
to: 1TB of DDR4-2133MHz memory in 16 DIMM slots, 6x PCI-E 3.0 slots
including 3x PCI-E 3.0 x16 slots for GPU/Intel® Xeon® Phi(TM)
coprocessors, 8x ports of Avago Technologies 3008 SAS3 (12Gb/s) with
software RAID, and dual GbE LAN ports. Workstations also feature 7.1 HD
audio, 11 USB ports (6 USB 3.0), SLI, Thunderbolt 2.0 AoC, Hyper-Speed
hardware acceleration, 7+ year product life cycle and 160W CPU support.
-- DP/UP Motherboards - X10 motherboards, the basis of Supermicro's Server
Building Blocks are available in dual-processor (DP) and uni-processor
(UP) server and SuperWorkstation configurations supporting the new
Intel® Xeon® processor E5-2600/1600 v3 product family. DP/UP
motherboards also feature advanced technologies including DDR4 2133MHz
memory, hot-swap NVMe, 12Gb/s SAS3, 10GBase-T/10G SFP+/56Gbps FDR IB
networking options, SATA Disk-on-Module (DOM), Thunderbolt 2.0 are
offered in a variety of form factors, including ATX, E. ATX, E.E. ATX.
(DP) X10DRC-T4+, X10DRC-LN4+, X10DRi-T4+, X10DRi-LN4+, X10DRi/-T,
X10DRW-i/-iT, X10DDW-i, X10DDW-iN, X10DRG-Q, X10DRL-I, X10DAi, X10DAC,
X10DAX; (UP) X10SRL-F, X10SRi-F, X10SRW-F, X10SRH-CF, C7X99-OCE
Supermicro will also debut its new compact Internet-of-Things (IoT) Gateway (SYS-E100-8Q) featuring a 4.1"x4" ultra-low power motherboard (MBD-A1SQN) supporting Intel® Quark X1021 (2.2W TDP) SoC, onboard 512MB DDR3 ECC memory, 1x Micro SDHC up to 32GB, 2x Mini-PCI-E slots, 1x ZigBee module socket, TPM 1.2, 2x 10/100Mbps RJ45, 1x RS-232 via DB9, 1x RS485 via screw terminal interface, 2x USB 2.0 (device & host), 1x Analog Input 8 channel 12-bit and 1x DIO. This new compact low-power system is optimized for embedded applications such as Smart Building/Home Gateway, Retail store or Warehouse Hub and Smart Factory IoT Gateways.
Visit Supermicro at IDF 2014 in San Francisco, California this week, September 9(th) through the 11(th) in Moscone Center West; Main Booth #700, NVMe Booth #975, Embedded/IoT Booth #168. For more information on Supermicro's X10 solutions visit http://www.supermicro.com/X10. For Supermicro's complete range of high performance, high-efficiency Server, Storage, Networking and Management solutions, visit http://www.supermicro.com.
Follow Supermicro on Facebook and Twitter to receive their latest news and announcements.
About Super Micro Computer, Inc.
Supermicro® (NASDAQ: SMCI), the leading innovator in high-performance, high-efficiency server technology is a premier provider of advanced server Building Block Solutions® for Data Center, Cloud Computing, Enterprise IT, Hadoop/Big Data, HPC and Embedded Systems worldwide. Supermicro is committed to protecting the environment through its "We Keep IT Green®" initiative and provides customers with the most energy-efficient, environmentally-friendly solutions available on the market.
Supermicro, Building Block Solutions and We Keep IT Green are trademarks and/or registered trademarks of Super Micro Computer, Inc.
Intel and Xeon are registered trademarks of Intel Corporation in the United States and other countries.
All other brands, names and trademarks are the property of their respective owners.
Vormetric and MongoDB Deliver Breakthrough Encryption Performance for NoSQL Big Data Environments
Strong data-at-rest security with breakthrough performance for the world's most popular NoSQL database powered by the latest Intel® Xeon® processors
SAN JOSE, Calif., Sept. 8, 2014 /PRNewswire/ -- Vormetric, a leader in enterprise data security for physical, virtual and cloud environments, today announced breakthrough performance for NoSQL database environments powered by the new Intel® Xeon® processor E5-2600 v3 product family and MongoDB, the leading NoSQL database. Using Intel Xeon E5 v3 processor innovations; including enhanced Advanced Encryption Standard New Instructions (Intel® AES-NI) hardware acceleration, AVX, wide data-path, as well as path optimization and extended multithreading from Vormetric Transparent Encryption:
-- Performance versus the previous Xeon processor E5-2600 v2 family
increased from 18% to 147%
-- Performance with encryption exceeded performance without encryption from
34% to 348% http://photos.prnewswire.com/prnvar/20130626/SF38541LOGO
Find the complete report here.
Historically, organizations have been concerned that adoption of encryption technologies might reduce throughput and capacity. With this combined solution set, not only is there no degradation in performance, but performance with encryption greatly exceeds that without encryption.
Click to Tweet: Think encrypting data-at-rest is slow? @Vormetric + @MongoDB +@Intel AES-NI is 30% to 300% faster than w/o encryption http://bit.ly/1pUTKZn
"Gains in performance are a direct result of both the enhanced Intel AES-NI hardware acceleration capabilities within the new Xeon processor E5-2600 v3 family, as well as optimizations in the Vormetric Transparent Encryption Linux kernel drivers. These optimizations greatly improve read and write throughput with MongoDB," said Ashvin Kamaraju, vice president of product development for Vormetric. "This combination enables customers to meet compliance requirements for encryption and access controls, while also helping to prevent data breaches, without having to trade off security for performance in their big data implementations."
Vormetric, Intel, and MongoDB Inc. worked together to integrate and test the combined configuration. The solution was benchmarked on servers configured with new Intel Xeon processor E5-2600 v3 processors, off-the-shelf MongoDB software and Vormetric Transparent Encryption.
"Intel and Vormetric continue to deliver innovative solutions to solve enterprises' most compelling business needs, including now protecting data-at-rest within MongoDB environments with breakthrough performance," said Shannon Poulin, vice president, Data Center Group, Intel. "Vormetric Data Security solutions are optimized to take advantage of innovations in the Intel® Xeon® processor E5-2600 v3 product family, enabling customers to achieve superior encryption performance which is imperative for protecting critical business data."
The solution both increases the raw performance of MongoDB implementations and provides the data-at-rest security that enables organizations to use sensitive data within their MongoDB environment. This configuration leverages the scalability and performance characteristics of all three components:
-- The Intel® Xeon® processor E5-2600 v3 product family featuring Intel®
Data Protection Technology with AES-NI hardware acceleration for
encryption and Secure Key.
-- MongoDB, the leading NoSQL database, is built for scalability,
performance and high availability, scaling from single server
deployments to large, multi-site architectures.
-- Vormetric Transparent Encryption's high performance architecture with
data-at-rest encryption, access controls, and access monitoring
information.
"With Vormetric, MongoDB customers not only gain critical safeguards required for use of sensitive data, but incur no performance penalties due to the additional performance boost available from the optimized Intel hardware encryption, and Vormetric's kernel driver optimization," said Vijay Vijayasankar, VP of Global Channels and Business Development at MongoDB Inc.
For a more detailed look at Vormetric Data Security solutions, be sure and stop by the Vormetric booth at the Intel Developer Forum (booth 114) during expo hours September 9-11.
About Vormetric
Vormetric (@Vormetric) is the industry leader in data security solutions that span physical, virtual, big data, and cloud environments. With data at risk as never before, Vormetric helps over 1400 customers, including 17 of the Fortune 30 and many of the world's most security conscious government organizations, to meet compliance requirements and protect what matters -- their sensitive data -- from both internal and external threats. The company's scalable Vormetric Data Security Platform protects any file, any database and any application --anywhere it resides -- with a high performance, market-leading data security platform that incorporates application transparent encryption, privileged user access controls, automation and security intelligence.
OtterBox Reveals Alpha Glass Design at Nolcha Fashion Week 2014
FORT COLLINS, Colo., Sept. 8, 2014 /PRNewswire/ -- Just as designers create clothing to complement their personal styles, OtterBox(®) carefully crafted Alpha Glass((TM)), an all-new fortified glass screen protector, to complement a smartphone's flawless design. In the spirit of style, designer Katty Xiomara will reveal her jaw-dropping creation at Nolcha Fashion Week 2014: a design composed of OtterBox Alpha Glass.
The OtterBox-inspired garment will be presented at Nolcha Fashion Week on Sept. 8 at the 6 p.m. runway show. With more than 20 designers showing their collections, Xiomara will make a memorable impression with her award-winning designs and elegant style.
"One of the most rewarding aspects of my work is overcoming obstacles," Xiomara said. "Creating an ensemble from glass screen protectors provides a unique challenge for me as it is something that has never been done. Alpha Glass complements my style perfectly, blending elegant and refined with an understated strength. Alpha Glass belongs on the runway and I can't wait to reveal our creation."
OtterBox Alpha Glass is a premium screen protector for Apple iPhone 5/5s, iPhone 5c and Samsung GALAXY S 5 devices. Alpha Glass offers flawless clarity and powerful protection thanks to the specially formulated ultra-thin shatterproof, scratch-resistant glass. Alpha Glass maintains a clean look and responsive feel, so users will hardly notice the extra layer that gives them runway-worthy confidence.
Alpha Glass includes a microfiber cloth, alcohol swab and applicator for precision application. Alpha Glass is available in a standalone version and an additional version that is compatible with Commuter Series, Commuter Series Wallet, Symmetry Series and Resurgence Power Case.
For more information on Alpha Glass, visit otterbox.com. For more information about Katty Xiomara and Nolcha Fashion Week, visit nolchafashionweek.com.
About OtterBox:
Founded in 1998 with a line of dry boxes, OtterBox(®) has evolved into the No. 1-selling case for smartphones in the U.S. and a global leader in mobile device protection.(1) Its diverse lineup of protective solutions for handheld technology protect, connect and enable a mobile world. OtterBox has been a six-time honoree on the Inc. 5000 list of fastest growing private companies in the U.S. and was named one of "America's Most Promising Companies" by Forbes Magazine. The company is headquartered in Fort Collins, Colo., with offices in San Diego; Boston; Cork, Ireland; and Hong Kong.
For more information, visit otterbox.com. We've Got Technology Covered.
Note:
(1 )No. 1-selling smartphone case source: The NPD Group/Retail Tracking Service: Cell Phone Device Protection/Units Sold 1/2012-12/2013
CITADEL100, a Leading Datacentre Owner and Operator Specialising in Designing, Developing and Operating 100% Availability Datacenters, Announced Today the Launch of its Online Data Centre Customer App, C100
DUBLIN, September 8, 2014 /PRNewswire/ --
CITADEL100 [http://www.citadel100.com ], a member of the Keppel Group, is Ireland's
leading datacentre owner and operator. CITADEL100 own and operate 65,000 square feet of
raised-floor mission critical datacentre space in the National Digital Campus at Citywest
in Dublin.
Citadel announced today the launch of its online customer app C100 which is designed
to further enhance customers' experience through easier communication and real-time access
to data on their respective colo environment. The launch of the C100 customer app will
provide customers with the information associated with their Colos environmental and
electrical systems, including the ability to launch and view the status of data centre
support tickets and access customer reports on environmental, operational and security
metrics. The app is available for customers by contacting the Citadel100 Operations Team
and can be viewed on the website [http://citadel100.com/services/c100-customer-portal ].
Karl Hennessy, CEO of CITADEL100 [http://www.citadel100.com ] said, "We are excited
about the functionality and features this customer app brings as an added benefit to our
valued data centre customers." In addition to making it easier for customers to engage
with CITADEL100's operations team, the app displays real-time metrics for each customer's
data centre environment within CITADEL100's Dublin data centre, including temperature,
humidity and Utility, UPS and Generator Power statistics.
The "PEMAC" section allows our customers access to our data centre maintenance
management system which allows customers to place and track service request orders through
a secure online ticketing system. The C100 customer app provides our customers with a
detailed analysis of how CITADEL100 [http://www.citadel100.com ] is meeting and performing
against the 100% Uptime Service Level Agreements (SLA) we offer.
Developed by CITADEL100's operations team, the app is the culmination of months of
planning, development and testing. The Customer app utilises CITADEL100's data centre BMS
(Building Management System), which has been extensively programmed by our in-house
engineering team. It utilises some 3,000 points to control and monitor all aspects of the
data centre environment.
The first launch of the C100 customer app will serve as the foundation on which the
company will continue to add features and functionality over time to improve customer
experience.
For further information on CITADEL100 [http://www.citadel100.com ] and its services
please contact us at:
Nest Learning Thermostat can now be controlled through LiftMaster's MyQ App
ELMHURST, Ill, Sept. 8, 2014 /PRNewswire/ -- LiftMaster (LiftMaster.com), the number one brand of professionally installed garage door openers, announced today that LiftMaster MyQ(® )Technology can now work with the Nest Learning Thermostat(TM), providing customers who opt into the integration with greater energy savings and comfort.
LiftMaster's proprietary MyQ technology allows customers to connect to and control, open or close their garage door anytime, anywhere in the world using the downloadable MyQ app and a MyQ-enabled opener, along with a connected smartphone, tablet or computer. With the Nest integration, when users open the garage door opener upon arriving home, MyQ can tell Nest they're home. When they close the door on the way out, the thermostat can go into "Away" mode for energy savings. LiftMaster MyQ users can also quickly and easily set their Nest Thermostats to "Home" and "Away" modes using the MyQ app.
As a Works with Nest product, LiftMaster's MyQ-enabled garage door openers were among the earliest products to integrate with Nest (Nest.com) through the Nest Developer Program.
"Through our integration with Nest, MyQ technology now gives our customers both convenience and energy savings in addition to the safety, security, and peace of mind they already enjoy," said Juan Lopez, Director of Marketing, Connectivity & Controls. "Whether customers forgot to close their garage door, need to let the service or repairman in when they're not at home, or are on vacation, LiftMaster's MyQ technology gives customers control anywhere, anytime."
MyQ technology is integrated into six LiftMaster Garage Door Openers - the LiftMaster(®) Elite Series(®) 8550, 8587, 8557 and 8500, as well as Premium Series models 8360 and 8355 - and selected LiftMaster Gate Operators. It can also be integrated into other garage door openers from LiftMaster, as well as other major garage door brands through LiftMaster's MyQ Garage(TM) accessory.
More than 16 million smart home systems will be installed in homes across the U.S. between now and 2017,[1] and LiftMaster is committed to providing the connected products that consumers want. LiftMaster's partnership with Nest is part of the company's commitment to the connected home space. For more information on MyQ, please visit LiftMaster.com.
About LiftMaster
LiftMaster is the number one brand of professionally installed residential garage door openers, as well as a major manufacturer of commercial door operators, residential and commercial gate operators, telephone entry systems and related access control products. Driven by the access and security needs of the marketplace, LiftMaster's expansive line of state-of-the-art residential and commercial products are designed to fit any lifestyle or application, providing the latest technology and innovations in safety, security and convenience. For inquiries on LiftMaster products or to inquire about becoming an authorized dealer, please visit LiftMaster.com.
Media Contact
Jefferson Day
Assistant Account Executive, Edelman
Jefferson.Day@edelman.com
312-240-2622
The Neat Company Takes the Power of Cloud Technology to the Next Level for Small Businesses
PHILADELPHIA, Sept. 8, 2014 /PRNewswire/ -- The Neat Company, known for their high-performing line of smart organization hardware and software, has not only embraced the ever-present power of cloud technology but taken advantage of its capabilities for small businesses. With cloud computing, small companies are able to run their businesses more efficiently, helping them stay competitive, profitable and most importantly, adaptable.
Neat's smart organization system with cloud and mobile transforms small businesses by:
1. Diminishing IT concerns and worries because any and all updates or
changes are made by the service provider. There is no software to be
downloaded or installed because once the change is made in the cloud, it
is updated universally.
2. Offering a financially friendly business model because most services have
no upfront cost and require only a flat monthly fee for subscription.
There is no need to replace expensive software programs due to the
adaptable nature of cloud services.
3. Providing secure protection of data because it is often managed by a
reliable third-party and not kept on a disk, server, or local area
network.
More than just scanning and storing important information in the cloud, The Neat Company has maximized the potential of cloud technology for small businesses. Chris Barbier, SVP of Product Management at Neat, explains:
"Beyond just migrating data to the cloud, Neat uses smarter organization based on item type and metadata extraction, which allows users to not only digitize their analog data but also prepare data for integration. Neat has integrations for all cases whether customers are interested in utilizing basic-to-advanced Excel, need simplified means to submit accounting records at tax time (TurboTax, Quicken, H&R Block), or accessing contact management software (Outlook, CampaignMonitor, ConstantContact, MailChimp, OBO). For sole proprietors or small businesses that need employees to wear multiple hats, efficiency seems to be the most appealing quality in new technology and that is where Neat can truly help. Once you've brought your data to the cloud, Neat answers the question "now what?" and brings your vital information to life. "
Using cloud services allows small businesses to securely store their data, rationally organize information, share it with multiple users across platforms, access it quickly via mobile technology, and integrate with third-party applications. NeatCloud gives small businesses a comprehensive set of tools that offers security, efficiency and reliability. Neat's smart organization system allows businesses to capture, unlock and unleash necessary information, giving them time to get to what matters.
About Neat®
Neat® is the leading provider of Smart Organization Systems for the small business and home markets. Neat's unique combination of cloud, mobile, desktop software and hardware scanning solutions transform important documents into usable digital information. Neat helps users organize, access and share both paper and digital documents simplifying everyday tasks so they have more time to get to what matters. Neat's solutions consist of NeatConnect®, NeatDesk®, NeatReceipts®, NeatCloud®, NeatVerify®, NeatScan® and Neat's mobile application. Learn more at http://www.neat.com.
SOURCE Neat
Neat
CONTACT: Kevin Feeley, Broadpath, Inc., 215-644-6505, kfeeley@broadpathpr.com
Leverage Proven Analog I/O Designs for FPGAs and Get to Market Faster with High-Precision and High-Speed Data Acquisition System
Maxim Integrated's powerful and easy-to-use GUI simplifies designs for precision signal chain applications.
SAN JOSE, Calif., Sept. 8, 2014 /PRNewswire/ -- FPGA engineers can quickly evaluate and validate their FPGA-based control systems and get to market faster, using the high-speed MAXREFDES74# 18-bit data acquisition system (DAS) reference design from Maxim Integrated Products, Inc. (NASDAQ: MXIM).
Achieving high-precision, high-speed digital control loops is a challenge for designers. But now the MAXREFDES74# DAS provides an 18-bit acquisition analog input and output front end for applications demanding high precision and high-speed data conversion based on FPGA digital processing. The MAXREFDES74# plugs directly into a standard FPGA I/O expansion (FMC) and is fully equipped with complete hardware, firmware for Zynq FPGAs, Maxim's easy-to-use PC-GUI, and Gerber files. The powerful online GUI tool displays the performance of the signal chain and eliminates the need for scopes or other equipment to generate and analyze waveforms, greatly simplifying the evaluation and validation phase. The MAXREFDES74# is a ready-made solution for analog inputs and outputs built for FPGA-based systems. It is flexible and applicable for a wide range of industrial and medical applications, including test and measurement, instrumentation, industrial automation and process control markets.
Key Advantages
-- Ease of design and faster time-to-market: high performance proven design
and GUI simplifies system validation, calibration, and data analysis,
offering a complete solution to optimize performance.
-- Flexibility: pin compatible 16- or 18-bit signal path ICs provide the
ability to tune designs for a variety of FPGA systems in different
applications.
-- High precision and high speed: 16- and 18-bit solutions provide
excellent precision and accuracy; an integrated fast SAR data converter
enables high speed data conversion.
Commentary
-- "Our reference design helps designers achieve faster time to market
thanks to a complete, high performance, proven board design as well as
Maxim's powerful and easy-to-use GUI," said Carmelo Morello, Business
Manager for precision converters at Maxim Integrated.
-- "Proven analog I/O designs help design engineers unleash the power of
SoCs and FPGAs," said Jim Beneke, VP, Global Technical Marketing at
Avnet Electronics Marketing. "This solution from Maxim will help SoC and
FPGA engineers validate their control systems quickly and easily when
combined with Avnet's Zedboard(TM)."
Availability and Pricing
-- The board is available for $95 at Maxim's website and select franchised
distributors. Evaluation software, GUI, and Gerber files are provided
free with the board.
-- For information on other reference designs, please visit Maxim's
Reference Design Center.
Hi-res images for the MAXREFDES74# reference design and MAXREFDES74# schematic are available.
About Maxim Integrated
Maxim is the leader in analog integration. From mobile to industrial solutions, we're making analog smaller, smarter, and more energy efficient. Learn more at http://www.maximintegrated.com.
Videon Central and Fujitsu Partner on New Encoder Module for Global Audio-Video Applications
Combines FSA's MB86MX IC with Videon's Software, Hardware Technology for Wide Range of Broadcast, Automotive, Aviation Designs
STATE COLLEGE, Pa. and SUNNYVALE, Calif., Sept. 8, 2014 /PRNewswire/ -- Videon, a leading developer of modules and middleware for audio and video designs, has joined with Fujitsu Semiconductor America to introduce a new semi-custom encoder module that will support communications and broadcast workflows, as well as automotive and aviation applications.
The new Videon encoder module will be released during this year's International Broadcasting Convention (IBC), scheduled for September 11-15 in Amsterdam. The module incorporates Fujitsu's high performance MB86MX encoder along with Videon's Avia AV Framework software and hardware technology.
Small Form Factor, Proprietary Algorithm to Reduce Processing Time
The Fujitsu MB86MX integrated circuit (IC) is designed for encoding, transcoding and transrating media to distribute high-definition video to virtually any device. The low-power, low bit rate IC features H.264/MPEG-2 bi-directional transcoding, HD/SD simultaneous dual stream outputs and low latency. It also supports multiple screens and video streaming.
While most chips require external RAM to process video, the MB86MX series incorporates Fast Cycle RAM (FCRAM) within the chip itself, allowing for a smaller form factor. The chip's proprietary algorithm enables higher image quality while reducing the processing burden, resulting in industry-leading levels of low power consumption of only 800mW in H.264 HD encoding. The small form factor and low power consumption combine with the high encoding quality typical of Fujitsu chips to make a strong foundation for this module.
With the chip is Videon's Avia AV Framework. Avia is a software solution that interfaces with a wide range of SoC processors to move media between different source and destination devices.
Avia enables the powerful MB86MX-based module to be incorporated into any AV workflow product, accommodating baseband and compressed video, IP and other connections. It encodes, decodes, transcodes and transrates H.264 video data, making it ideal for broadcast and infocomm applications.
Videon VP Scott Kovesdy said, "This module will help customers reduce the time-to-market needed to incorporate the latest technologies, like IP streaming and compressed H.264 video. We're very pleased to have Fujitsu technology in a Videon product. Together, the MB86MX and Avia AV Framework make for a highly-capable, highly-customizable device."
"This new module delivers state-of-the-art performance with minimal power requirements and a small total footprint," said Anthony Wong, senior product manager at Fujitsu Semiconductor America. "It's an ideal semi-custom module for many advanced applications."
The partnership between Fujitsu and Videon began in November 2013. Pre-orders will be taken at http://store.videon-central.com during IBC.
About Videon
Videon develops products for automotive infotainment, in-flight entertainment and the global AV industry that simply, quickly and cost-effectively move digital media. With over 30 million devices using our streaming media, DVD and Blu-ray technology, Videon is a proven partner and supplier to the world's leading technology companies. Based in State College, Pennsylvania, Videon Central, Inc. was founded in 1997 and is a privately held company.
Fujitsu Semiconductor America, Inc. (FSA) is a leading designer and developer of innovative semiconductor products and solutions for new generations of consumer, communications, automotive and industrial products. FSA provides a comprehensive portfolio of high-quality, reliable semiconductor products and services throughout North and South America. Founded in 1979 and headquartered in Sunnyvale, California, Fujitsu Semiconductor America is a wholly owned subsidiary of Fujitsu Semiconductor Limited (FSL), Japan.
Company and product names mentioned herein are trademarks or registered trademarks of their respective companies. Information provided in this press release is accurate at time of publication and subject to change without advance notice.
AccessData and HP Extend Incident Response Services in the Wake of Increased Attacks
Best of Breed Cybersecurity Solutions and Services Minimize the Damaging Impact, Risks and Costs to Global Enterprises
MENLO PARK, Calif., Sept. 8, 2014 /PRNewswire/ -- AccessData, the leader in incident resolution solutions, today announced an extended collaboration with HP to address the major challenges global organizations face following a major cyber-attack. New offerings through HP's Digital Investigations Services integrate AccessData's ResolutionOne(TM) Platform to provide advanced threat intelligence and rapid incident response across company networks, endpoints, mobile devices and applications.
HP's Rapid Incident Response (RIR) Services help organizations immediately following an attack with leading edge technology and expertise to provide rapid, onsite digital investigations and forensics. The integration of the ResolutionOne Platform speeds up the process through continuous, automated incident resolution. This solution enables comprehensive, real-time insight, analysis, response and resolution of data incidents.
"The robust RIR services combine HP's extensive security expertise with the ResolutionOne Platform to remediate the sophisticated attacks threatening enterprises," said Craig Carpenter, CMO, AccessData. "HP chose ResolutionOne for its seamless integration into infosec environments, SIEM interoperability and threat feed consumption capabilities for collective intelligence, automated detection, analysis and resolution."
"AccessData carries proven and deep experience around cybersecurity and forensics," says Rob Stitch, Director Global Professional Services, HP Enterprise Security Services. "The ResolutionOne Platform delivers what our customers need, powerful continuous and automated incident resolution capabilities so organizations can quickly recover and secure their IT environments."
The ResolutionOne Platform's network and host-based forensics extends the functionality of HP's RIR service with advanced capabilities: comprehensive root cause analysis, full packet capture network forensics, advanced computer forensics (hard drive, memory, and peripherals), malware triage, and enterprise-wide auditing for compromise assessment. ResolutionOne also enables real-time collaboration among all security and response teams, and provides automated batch remediation so organizations can eradicate threats, not just contain them.
About AccessData
AccessData Group makes the world's most advanced and intuitive incident resolution solutions. AccessData technology delivers real-time insight, analysis, response and resolution of data incidents, including cyber threats, insider threats, mobile and BYOD risk, GRC (Governance Risk & Compliance) and eDiscovery events. Over 130,000 users in corporations, law enforcement, government agencies, and law firms around the world rely on AccessData software to protect them against the risks present in today's environment of continuous compromise. http://accessdata.com.
Follow us on Twitter at @AccessDataGroup.
About HP
HP creates new possibilities for technology to have a meaningful impact on people, businesses, governments and society. With the broadest technology portfolio spanning printing, personal systems, software, services and IT infrastructure, HP delivers solutions for customers' most complex challenges in every region of the world. More information about HP (NYSE: HPQ) is available at http://www.hp.com
Media Contact:
Judy Kaneko
AccessData
408-769-1673
jkaneko@accessdata.com
ZNYX Announces High-Density B1 Top-Of-Rack Switch Platform for Security And NFV
Latest Virtualization Platform Innovation for Network Services to Be Displayed at IDF14 (Booth 763)
FREMONT, Calif., Sept. 8, 2014 /PRNewswire/ -- ZNYX Networks(®), an innovator of high-density platforms for virtualization and mission critical environments, today announced the B1 top-of-rack switch platform for security and NFV (network function virtualization) with an integrated Intel(®) Xeon(®) server-class compute environment. As the latest virtualization platform for network services, the B1 platform delivers twice the density in half the rack space at two-thirds the cost of comparable systems.
The patent-pending B1 tightly couples the network services of an Ethernet switch with an Intel(®) Atom(®) processor C2000, and a dual Intel(®) Xeon(®) processor E5-2600 v2 compute resource. A powerful 400G switch fabric with twenty-four 10 Gbps ports and four 40 Gbps ports provide switching capacity for the entire rack. This combination delivers the high performance required for line-rate service chaining to applications in the data path.
"Many of today's network-edge systems, and command and control platforms, require low-cost, high performance technologies in compact form factors," said David Parkinson, vice president of hardware engineering, ZNYX Networks. "No other single product delivers the processing power, level of integration, or flexibility of the ZNYX B1 platform."
The B1 is an affordable entry-level 1U solution that provides the capacity to add or change applications for future needs. The ZNYX B1 top-of-rack switch platform is ideal for NFV applications, network and security appliances, high-end routers, and end-of-row or top-of-rack security devices. In a multi-tenant server rack, the B1 is able to deploy services for specific servers in the rack, enable individual service configurations for servers, and isolate services for different departments within an enterprise.
The ZNYX B1 platform is also an ideal network-edge gateway device for customer-premises equipment (CPE), such as MPLS routing services for the network, and provides the breakout switching required on-premises.
Any networking application or operating system can run either virtualized or bare-metal on the B1 compute environment providing common services, such as load balancing and security, required by the servers in a rack. The B1 open compute environment supports both the KVM (Kernel-based Virtual Machine) hypervisor for embedded virtualization, or VMware(®) software enabling simple integration within existing data center infrastructures.
"Network security and services functions can now be integrated into the top-of-rack switch by utilizing virtualized applications that are easy to acquire and deploy," said Kevin Austin, general manager, ZNYX Networks. "This design delivers a new standard in multi-layer security, and preserves valuable rack space for a higher density of servers. With unmatched functional density for top-of-rack switches, B1 delivers unprecedented consolidation, ease of management, and cost savings for enterprises, data centers, and telecom."
Utilizing virtualized applications on the B1 platform eliminates the hardware tax required to install multiple appliances. The software for load balancer, firewall, anti-virus, web application firewall, malware detector, and intrusion detection/intrusion prevention can be deployed from the virtualization ecosystem on the B1. This approach lowers CAPEX and reduces the time-to-deployment.
Included at no charge with the platform, ZNYX's OpenArchitect (OA) Ethernet Switch operating system is an open Linux environment that is feature-rich with network protocols, configuration, packet vectoring, and high availability. The open OA solution allows the switch environment to be customized to satisfy each customer's unique requirements. The common interface across the ZNYX family of products allows system architects to intelligently scale their deployments.
The B1 top-of-rack switch platform will be displayed in the ZNYX booth (#763) at the Intel Developer Forum 2014 (IDF14), September 9-11, at the Moscone West Convention Center in San Francisco.
About ZNYX Networks
ZNYX Networks (http://www.znyx.com) is an innovator of high-density platforms for virtualization and mission critical environments. Designed for enterprise, data center, military, aerospace and telecommunications industries, ZNYX offers a complete portfolio of fully integrated platforms, as well as leading AdvancedTCA(®), CompactPCI(®) and custom compute blade, switch, and software technologies. Equipment manufacturers, application providers and systems integrators rely on ZNYX to create solutions that are optimized for performance, time-to-market, reliability, and cost-of-ownership. ZNYX operates sales and technology centers in Fremont, Santa Barbara and San Luis Obispo in California, as well as Ridgeland, Mississippi. ZNYX is a general member of the Intel(®) Internet of Things Solutions Alliance, a community of communications and embedded developers and solution providers. ZNYX is a VMware(®) Technology Alliance Partner (TAP).
CTIA Selects SocialRadar as Official Super Mobility Week Networking App
Innovative Social App to Bring a Smarter Networking Experience at the Annual Tradeshow
WASHINGTON, Sept. 8, 2014 /PRNewswire/ -- CTIA-The Wireless Association® and SocialRadar announced a partnership today to change the way people meet and connect during Super Mobility Week. Using the SocialRadar app, when attendees arrive at the conference, they will know who is there, how they are connected and what they have been up to, while retaining full control over their privacy.
Available for iOS and Android, the SocialRadar app gives users real-time information about the people around them. Combining real-time social network and geo-location data, the app merges information from the top social networks, including Facebook, LinkedIn, Twitter, Instagram, Foursquare and Google+, from your device.
Attendees can use the app today by:
1. Downloading the app on the Apple Store or Google Play
2. Using the side Navigation Menu and selecting "Join Group"
3. Selecting "CTIA Super Mobility Week"
"Networking is one of the top reasons people attend Super Mobility Week - North America's Largest Wireless Event. By offering our 40,000 attendees SocialRadar, they can identify who they want to talk with before they even arrive which will help them break the ice and strengthen business relationships at CTIA," said Robert Mesirow, CTIA Vice President and Show Director.
"When we thought of the idea of SocialRadar, we knew that conferences and events would be the perfect scenario for professionals to meet and connect using our app," said Michael Chasen, Chief Executive Officer and Founder of SocialRadar. "Our vision was to create technology that combines the smartphone's location and the power of social networks, empowering people to improve the way they network. We're excited to partner with CTIA to beta test our conference functionality."
CTIA-The Wireless Association® (http://www.ctia.org) is an international organization representing the wireless communications industry. Membership in the association includes wireless carriers and their suppliers, as well as providers and manufacturers of wireless data services and products. CTIA advocates on behalf of its members at all levels of government. The association also coordinates the industry's voluntary best practices and initiatives, and sponsors the industry's leading wireless tradeshow. CTIA was founded in 1984 and is based in Washington, D.C.
About SocialRadar
SocialRadar is building technology that gives you real-time information on the people around you. Conferences and organizations use SocialRadar to enable participants to see who they are connected to, meet people they want to network with and stay in touch after the event. With an innovative technology platform for iOS, Android and Google Glass, the SocialRadar application will fundamentally change the way people connect online and in the real world.
ARRIS and Playcast Lead TV Cloud Gaming Revolution for MEO in Portugal
Blockbuster console gaming now directly available via the set-top
SUWANEE, Ga. and LOS ALTOS, Calif., Sept. 8, 2014 /PRNewswire/ -- ARRIS Group, Inc. (Nasdaq: ARRS) announced today the availability of an AAA cloud gaming service, powered by Playcast Media, for TV subscribers of MEO, featuring dozens of popular games from a variety of genres including racers, shooters, action adventure and fighting titles. The cloud gaming industry is set for growth with industry analysts believing it could exceed $1 billion in 2019 from $281 million this year.
Game franchises made available under MEO's Meo Jogos brand include Street Fighter, the Lego Series, Sonic Generations, and the Batman series for an affordable monthly subscription.
To provide fans with a console quality experience, ARRIS and Playcast optimized the performance of ARRIS set-tops to create an ultra-low latency, reliable, glitch free gaming experience. Thanks to Playcast's cloud gaming service, users are able to play and save games without the need to purchase either an expensive video games console or physical copies of games.
"ARRIS is proud to support MEO in delivering a new and differentiated experience. The demand we are seeing to deliver games from the set-top via the cloud is significant and Playcast is at the forefront of this cloud gaming industry. We're very excited to join Playcast and MEO in seizing this opportunity," said Steve McCaffery, Senior Vice President, EMEA & Asia Pacific, ARRIS.
"The ARRIS set-top delivers an outstanding gaming experience thanks to its low latency exceptional crisp video," said Guy de Beer, Playcast CEO. "Combined with MEO's high quality network users can experience quality gameplay comparable to consoles at a fraction of the cost. Cloud is the true next-generation gaming experience and is rapidly evolving as broadband services mature. Playcast already reaches millions of players around the world and this collaboration is the first step for us to tap into ARRIS's global footprint."
Playcast Media is provides a global cloud gaming service. It features the world's major video game brands and packages them in a set of affordable sales models, including monthly subscriptions and various rental models. The game streaming service is offered to users through devices such as set-top boxes, microconsoles, smart TVs and other video-enabled connected devices. Playcast's service has been in commercial operation since 2011, serving hundreds of thousands of TV subscribers in 55 countries.
About MEO
MEO is a reference communications brand in the Portuguese market, incorporating the innovation and technology strategy of the operator that aims to improve the lives of its customers through the unique ability to integrate converged technologies, equipments and services.
About ARRIS
ARRIS is a global innovator in IP, video and broadband technology. We have continually worked with our customers to transform the experience of entertainment and communications for millions of people around the world. The people of ARRIS are dedicated to the success of our customers, bringing a passion for invention that has fueled our history: We created digital TV, delivered the first wireless broadband gateway and are pioneering the standards and pathways for tomorrow's personalized, Ultra HD, multiscreen, and cloud services. We are dedicated to meeting today's challenges and preparing for the tasks the future holds. Collaborating with our customers, ARRIS will continue to solve the most pressing challenges of 21st century communications. Together, we are inventing the future. For more information: http://www.arrisi.com
Revolutionary Vacuum Brand Introduces New Cleaning Technology to Meet Demands of Growing Ultra Soft Style Carpet Market
NEW YORK, Sept. 8, 2014 /PRNewswire/ -- Soniclean, a new high-tech manufacturer of upright vacuum cleaners noted for its proprietary sonic cleaning technology, recently announced the launch of its new Soft Carpet(TM) vacuum cleaner to address the growing demand for a vacuum cleaner capable of successfully cleaning luxurious ultra soft style carpeting.
It is forecasted that 30% of the carpets produced by leading manufacturers will be "ultra soft style" by the end of 2014. Although ultra soft style carpets are at the forefront of residential carpet technology, their lush, dense carpet piles make routine vacuuming a difficult task. Soniclean, the first vacuum to combine suction with sonic cleaning technology, has designed a vacuum specifically capable of efficiently cleaning ultra soft style carpets in addition to normal carpeting and hard floors.
The Soniclean Soft Carpet(TM) features a unique vent system and larger molded rubber wheels to allow the vacuum to "float" on the carpet's surface. Soniclean has also designed a unique soft bristle brush roll that provides a deep clean, while preventing damage to the plush fibers found in ultra soft carpeting. When the vent system is closed, the Soniclean Soft Carpet(TM) vacuum cleaner is instantly converted into a conventional vacuum cleaner that effectively cleans other types of carpeting and hard floors.
"As the ultra soft style carpet market continues to flourish, we wanted to meet the growing demand for a vacuum that simplifies the often difficult cleaning process," said Mark Bosses, CEO of Soniclean. "Our new Soft Carpet(TM) vacuum technology will not only make the cleaning process easier for the consumer, it will also help protect the plush fibers found in luxurious ultra soft style carpeting."
The Soniclean Soft Carpet(TM) vacuum also features a patented sonic bar, located behind the brush roll, that produces 200 sonic vibrations per second to dislodge and remove embedded particulate from the carpet pile. The vacuum cleaner also features a jam protection system that automatically shuts the power off if there is a jam in the brush roll. The Soniclean Soft Carpet(TM) vacuum cleaner weighs only 10.5 Lbs. which allows the vacuum to be carried from room to room and up and down stairs with ease.
About Soniclean
Soniclean brings sonic technology into vacuuming for the first-time ever, offering an efficient and advanced cleaning system to the market as well as one of the most rewarding at-home cleaning experiences for consumers. Soniclean effectively cleans at 12,000 vibrations per minute and the system can tackle both carpet and hard floors. In addition to dislodging and removing blatant dirt and dust, Soniclean effectively removes microscopic particles deeply embedded and ground into carpet - particles that contain allergens, bacteria and more. Incredibly light, weighing only 10.5 lbs, the Soniclean also features sophisticated jam sensor technology, a low profile to clean under furniture and a lifetime belt warranty and an optional aroma therapy technology called Sonicfresh. For more information, visit http://www.mysoniclean.com or http://www.facebook.com/TheSonicleanVacuum.
SOURCE Soniclean
Soniclean
CONTACT: PR Contact: Mike Vizza, 5W Public Relations, 212.999.5585, mvizza@5wpr.com
Ultra-Slim Expression Premium XP-820, XP-620 and XP-520 Offer Unparalleled Connectivity, Fast Home Printing and Convenient Scan to Facebook Capabilities
LONG BEACH, Calif., Sept. 8, 2014 /PRNewswire/ -- Epson America, Inc. today announced its next-generation of Epson(®) Expression(®) Premium XP-820, XP-620 and XP-520 Small-in-One(TM) printers, designed to deliver ultra-powerful performance, featuring consumer-rated unbeatable photo quality(1) and crisp, sharp text with Epson's exclusive MicroPiezo(®) printing technology and Claria(®) Premium inks. The Expression Premium family is also equipped with Epson Connect(TM) for the ability to access, print and scan documents, photos, emails and web pages from a tablet, smartphone or computer from literally anywhere in the world(2).
Always ready to print, the Expression Premium Small-in-Ones offer auto two-sided printing to save paper and easy to use creative tools such as a dedicated photo tray for printing lab-quality photos up to 8"x10" borderless. Time-saving, bonus templates are also available for printing lined school paper, graph paper, calendar pages, and custom note paper with personal photos - all without a computer. Designed as complete wireless solutions, the Expression Premium printers also feature built-in Wi-Fi CERTIFIED((TM)) n(3 )and Wi-Fi Direct((TM) )for network-free printing as well as built-in memory card slots and USB slots for PC-free printing(4).
The Expression Premium Small-in-Ones also enable users to edit, scan and share photos directly to Facebook(TM) or other popular cloud services all in one single workflow. The Snapshot blog on the Epson Community offers additional information and suggestions for scanning and sharing old memories and photos to Facebook and the cloud.
"Consumers really do get it all with these new models - unbeatable photo quality, time-saving auto features and advanced mobile printing technology - complete with instant memory sharing via scan-to-Facebook," said Carrie Brown, Group Product Manager, Consumer Ink Jets, Epson America, Inc. "The new Expression Premium Small-in-Ones provide busy, multi-tasking families and photo enthusiasts with a versatile everyday home printing tool, packing a robust feature set into an ultra-powerful, ultra-slim design."
The flagship Expression XP-820 adds a 30-page Auto Document Feeder that supports auto two-sided color copying, scanning and faxing, specialty paper support through a rear paper feed(5), and a 4.3-inch touchscreen with gesture navigation that enables easy setup and operation. Other convenient features include CD/DVD printing, Ethernet for expanded connectivity, and a convenient retractable auto-extend paper output tray to capture paper when printing remotely.
-- Epson Connect - a suite of free mobile printing solutions including
Email Print, Epson Creative Print, Epson iPrint((TM)), Epson Remote
Print and Epson Scan to Cloud, to print documents, photos, emails and
web pages from remote locations to any Epson Connect-enabled printer
-- Supports Android(TM) Printing, Kindle Fire(TM) Printing and Google
Cloud Print(TM)
-- Epson Connect Solutions Finder is available to help users quickly
determine and compare which mobile solution supports their mobile
devices or printer
-- Smudge, scratch, water and fade resistant(6 )photos, up to 8" x 10"
borderless
-- Fast print speeds of 14 ISO ppm for black and 11 ISO ppm for color, 13
ISO ppm for black and 10 ISO ppm for color and 9.5 ISO ppm for black and
9 ISO ppm for color for the XP-820, XP-620 and XP-520 respectively(7)
-- Print borderless 4" x 6" photos - in as fast as 12 seconds(8) (XP-820)
-- High-quality scanning up to 4800 dpi (XP-820) and 2400 dpi
(XP-620/XP-520)
-- Individual ink cartridges to replace only the color needed; standard and
high-capacity (XL) black and color ink cartridges accommodate various
printing needs(10)
-- Eco-friendly features, including ENERGY STAR(®) qualified, support of
recycled paper, RoHS compliant and designed to be recycled(9)
Pricing and Availability
The Epson Expression Premium XP-520 ($129.99*), XP-620 ($149.99*) and Epson Expression XP-820 ($199.99*) are available now through major retailer stores nationwide. For more information, please visit http://www.epson.com.
About Epson
Epson is a global innovation leader dedicated to exceeding expectations with solutions for markets as diverse as the office, home, commerce, and industry. Epson's lineup ranges from inkjet printers, printing systems and 3LCD projectors to industrial robots, smart glasses and sensing systems and is based on original compact, energy-saving and high-precision technologies.
Led by the Japan-based Seiko Epson Corporation, the Epson Group comprises more than 73,000 employees in 94 companies around the world, and is proud of its ongoing contributions to the global environment and the communities in which it operates. Epson America, Inc. based in Long Beach, Calif. is Epson's regional headquarters for the U.S., Canada, and Latin America. To learn more about Epson, please visit: http://www.Epson.com.
Specifications are subject to change without notice. EPSON, Claria, Expression and MicroPiezo are registered trademarks and Epson Connect and Epson iPrint are trademarks of Seiko Epson Corporation. Small-in-One is a registered trademark of Epson America, Inc. All other products and brand names are trademarks and/or registered trademarks of their respective companies. Epson disclaims any and all rights in these marks.
(1 )Unbeatable photo quality when compared to leading photo all-in-one printers as of February 2013, validated through independent testing
(2 )Most features require an Internet connection to the printer, as well as an Internet- and/or email-enabled device. For a list of Epson Connect enabled printers and compatible devices and apps, visit http://www.epson.com/connect
(3 )Wi-Fi CERTIFIED(TM); level of performance subject to the range of the router being used. Wi-Fi Direct may require printer software.
(4 )Adapter may be required
(5 )Specialty paper support accommodated through rear paper feed, maximum 23 mil paper thickness, manual 2-sided printing only
(6) Smudge, scratch, water and fade resistant on Epson photo papers. For CDs/DVDs, resistant only on specially-treated discs
(7 )ISO ppm is based on the new international standard for measuring print speed. Black and color print speeds are determined in default, single-side mode, in accordance with ISO/IEC 24734. Actual print items will vary based on system configuration, software, and page complexity. See http://www.epson.com/printspeed for details, including complete ISO reports
(8 )Color photo in Draft Mode on Premium Photo Paper Glossy measured from start of paper feed. Actual print times will vary based on system configuration, software, and page complexity. For more information, visit http://www.epson.com/printspeed
Magisto Announces the Arrival of "Hands Free" Video Creation
New "Surprise Me" video editing feature uses artificial intelligence technology to produce and deliver personal movies made from smartphone media content without any manual input
NEW YORK, Sept. 5, 2014 /PRNewswire/ -- Magisto, the cloud-based mobile video platform that uses artificial intelligence to create high-quality movies from users' photo and video footage, today announced the launch of a fully AI-powered editing feature called Surprise Me. The new feature automatically determines when enough new media has been added to a life event, analyzes the content and combines the relevant photos and videos into a unique and emotionally powerful personal video that gets delivered to the user.
With the arrival of Surprise Me, Magisto hopes to bring to life the unused media clutter present on most smartphones and transform these otherwise dormant and abandoned videos and photos into personal movies through a friction-free experience.
Surprise Me has been available in beta since April 2014 to Magisto's 40 million users worldwide. The platform has produced a total of 12 million Surprise Me videos made across its iOS and Android apps. Users have shared their Surprise Me stories nearly a million times on social networks and reaction to Surprise Me videos has been positive with movies receiving an average 4 stars out of 5.
"Magisto was born from my desire to find a way to easily create keepsake movies of my family," said Dr. Oren Boiman, CEO and Co-founder of Magisto. "I never imagined that one day over 40 million people would use the Magisto technology to create and share millions of videos. Magisto's growing success is a testament to the ability of AI-enhanced technology to enrich the human experience and deepen our emotional connectedness."
Artificial intelligence and connectedness have become inseparable components of the technologies that touch most of our lives each day. Whether we are unlocking our cars with our phones or receiving recommendations tailored to our tastes, AI is the unseen engine driving these deeply personal experiences. Magisto has long been a leader in applying this evolved technology to the video editing process: first with the introduction of its Emotion Sensing Technology which generates a deep understanding of what's actually occurring within the scenes of a video and today, with the launch of a fully automated movie creation experience.
Unlike a regular Magisto movie that is made when a user identifies the content to be fed into a video, a Surprise Me video is fueled by artificial intelligence from start to finish.
The feature analyzes a user's camera roll, selecting from current events and nostalgic events, to create a brand new video that uses content, theme, music, and effects selected solely by Magisto's patented Emotion Sensing Technology. The number of Surprise Me movies that Magisto serves its users depends on the user's activity and how much content they feed into their profile. When a movie is created, the user receives an alert at which point they can watch the movie and decide to delete it, keep it, tweak it to their specifications and share it through their own social networks. The six-month beta period has increased the technology's intelligence, speed and ability to accurately and intuitively analyze and combine videos and photos into an emotionally coherent video.
Examples of public Surprise Me videos from Magisto users can be found here: http://www.magisto.com/album/video/cSN8DARTHll5JywPYnZLB3k
.About Magisto
Driven by artificial intelligence and simple user experience, Magisto is a cloud-based mobile technology service for creating and sharing beautiful quality personal movies. It automatically selects the most compelling moments from ordinary videos and photos and, like an expert video editor, weaves them together to convey a story with customized styles and music. Magisto is used by millions of customers and can be accessed across iOS, Android, the Amazon Appstore for Android and the Web, and is the highest-rated video creation app in the Google Play and iOS App Stores. More information is available at http://www.magisto.com/about and http://www.magisto.com/how-it-works.
YESCO Electronics Manufactured and Installed New Video System at LSU Tiger Stadium
LOGAN, Utah, Sept. 5, 2014 /PRNewswire/ -- YESCO Electronics has manufactured and installed a state-of-the-art video system for Louisiana State University Tiger Stadium in Baton Rouge. The displays are part of the expansion of the historic 90-year-old stadium. The video upgrades will be turned on for the Tiger's home opener against Sam Houston State on September 6, 2014.
"LSU is pleased to bring a new visual experience to Tiger Stadium with the high-definition imagery of the new video board system," said Eddie Nunez, Senior Associate Athletic Director. "The capabilities that we will be able to implement on game day will only enhance what is already the best atmosphere in college football. The innovative team at YESCO understood our needs and outperformed our expectations."
Death Valley fans will watch game time action and instant replays in crisp, high definition detail. The north end zone features a 28' x 80' video screen along with two 375 square foot auxiliary displays. Two 40' x 68' screens provide a striking new look to the south end zone. YESCO also manufactured over 1,300' of fascia displays for the south, east and west sections of the stadium. Each video screen features a true 16 mm pixel pitch. The project was designed by Anthony James Partners.
"We are very excited to be a part of the Tiger Stadium expansion team," said Chris Olinger, Director of Live Event Sales for YESCO Electronics. "It is gratifying for us to be able to provide a display package for LSU featuring color contrast and image processing as advanced as any stadium in college football. We are also customizing a 'first of its kind' expanded color pallet to complement the schools iconic brand image."
YESCO Electronics LED screens are manufactured in the USA and are UL Green Leaf Certified for energy efficiency.
About the Tiger Stadium Expansion
Along with the new video screen package, the Tiger Athletic Foundation added an upper deck, suites, and club seats to the stadium's south end. The added capacity will bring the total to near 102,320, ranking Death Valley among the largest stadiums in the NCAA.
About YESCO Electronics
YESCO Electronics is a leading manufacturer of high quality electronic displays and a part of YESCO which has been a family run business since 1920. YESCO is best known for its creativity, reliable display products, image quality, and installation and project management expertise. YESCO has manufactured thousands of displays systems, installed worldwide, and specializes in customized video solutions for sports and commercial applications. For more information, visit yescoelectronics.com, email yesales@yesco.com or call toll free 1-866-989-3726.
SOURCE YESCO Electronics
YESCO Electronics
CONTACT: Ryan P. Young, 801-864-9963, rpyoung@yescoelectronics.com
Toshiba Introduces New Low-Profile Photocouplers for IGBTs and Power MOSFETs
Rail-to-Rail Gate-Drive Photocouplers in SO6L Package Reduce Height by 54 Percent
IRVINE, Calif., Sept. 5, 2014 /PRNewswire/ -- Toshiba America Electronic Components, Inc. (TAEC)*, a committed leader that collaborates with technology companies to create breakthrough designs, today announced a new series of low-profile, rail-to-rail output gate-drive photocouplers for directly driving low- to medium-power IGBTs and power MOSFETs: the TLP5751, TLP5752 and TLP5754.
The TLP5751 offers a peak output current of +1.0A and can drive power MOSFETs and low-power IGBTs up to 20A. The +2.5A TLP5752 and +4.0A TLP5754 will drive power MOSFETs and IGBTs with current ratings to 80A and 100A, respectively. Operating temperature is from -40 degrees C to 110 degrees C, and target applications include home appliances, factory automation equipment and inverter designs that require high levels of isolation and stable operation across an extended temperature range.
All of the new photocouplers are housed in a low-profile SO6L package. This package is 54 percent smaller in terms of height than photocouplers that use a DIP8 package - and uses just 43 percent of the board mounting area. Despite their low height, the new photocouplers have a guaranteed creepage distance of 8mm and an isolation voltage of 5kV.
The TLP57xx devices offer rail-to-rail output, delivering stable operation and enhanced switching performance. Power supply voltage is from 15V to 30V and maximum supply current is 3.0mA.
The TLP5751, TLP5752 and TLP5754 are comprised of a GaAlAs infrared LED and integrated high-gain, high-speed photodetector, and feature an undervoltage lockout (UVLO) function. An internal Faraday shield ensures a guaranteed common-mode transient immunity of +35kV/ s. Maximum propagation delay time is rated at 150ns, and maximum propagation delay skew at 80ns.
For more details, samples and pricing information, please contact your local Toshiba Sales Office.
*About Toshiba Corp. and TAEC
About TAEC
Through proven commitment, lasting relationships and advanced, reliable electronic components, Toshiba enables its customers to create market-leading designs. Toshiba is the heartbeat within product breakthroughs from OEMs, ODMs, CMs, VARs, distributors and fabless chip companies worldwide. A committed electronic components leader, Toshiba designs and manufactures high-quality flash memory-based storage solutions, solid state drives (SSDs), hard disk drives (HDDs), solid state hybrid drives (SSHDs), discrete devices, custom SoCs/ASICs, imaging products, microcontrollers, wireless components, mobile peripheral devices, advanced materials and medical tubes that make possible today's leading smartphones, tablets, cameras, medical devices, automotive electronics, industrial applications, enterprise solutions and more.
Toshiba America Electronic Components, Inc. is an independent operating company owned by Toshiba America, Inc., a subsidiary of Toshiba Corporation, Japan's largest semiconductor manufacturer and the world's sixth largest semiconductor manufacturer (Gartner, 2013 Worldwide Semiconductor Revenue, April 2014). Founded in Tokyo in 1875, Toshiba is at the heart of a global network of over 590 consolidated companies employing over 200,000 people worldwide. Visit Toshiba's web site at http://www.toshiba.co.jp/index.htm.
COCONE Singapore Launches Japan's Undisputed Social Mobile Game, Mini Me Globally!
The highly anticipated chart topping Mini Me widely enjoyed by Japanese players is now available globally!
SINGAPORE, Sept. 5, 2014 /PRNewswire/ -- COCONE Singapore Pte. Ltd. ("COCONE Singapore"), a wholly-owned subsidiary of COCONE Corporation ("COCONE Corp"), today announced the release of a major update for MINI ME, a free to play social networking mobile app game where you can explore a virtual world, chat amongst friends, customize your avatar and even your very own home! The mobile app is now available in both the Apple App Store and on Google Play globally.
With its wide success in Japan, things are only going to get more exciting as this popular social app game is boosted with a new set of updates to improve and enhance the social experience for its players.
Developed by COCONE Corporation, Mini Me is supported by colorful 3D graphics and is equipped with a huge collection of content customization. Players can purchase, expand and furnish their own worlds and own virtual homes, collect and store cool fashion gears and enjoy the numerous rewarding quests and engaging events.
"As the first ever social title that we are releasing globally, we at COCONE Singapore are really excited about the updates and improvements that our valued players can expect from Mini Me," shares Mr. Eric Lee, CEO of COCONE Singapore.
COCONE CORPORATION is a Tokyo based company established in 2007 that develops and publishes mobile game and application services. Cocone Corporation has launched several websites and applications dedicated to improving languages. Mobile games of different genres were also launched to cater the fast growing mobile gaming market. Cocone Corporation's vision is creating a new world where people can express themselves freely without the boundary of languages.
COCONE SINGAPORE is a wholly-owned subsidiary of Cocone Corporation and serves as a gateway into Southeast Asia for expansion of overseas mobile game and application services. Cocone Singapore is strongly dedicated to connect people's hearts via network and strives to be the optimal medium for people to express themselves through Cocone's entertainment contents.
TCL to Show AAA Game Streaming With Playcast and Netrange at IFA 2014
BERLIN, September 5, 2014 /PRNewswire/ --
Smart TV vendor shows full catalog of AAA console quality video games in the world's
leading tradeshow for Consumer Electronics
TCL, one of the world's fastest growing TV brands is showing a console quality game
streaming experience at its IFA tradeshow booth in Berlin.
Game streaming is a technology in which videos of major brands AAA, next generation
video games are executed on a remote cloud server, and streamed over the internet directly
to the TV set, without requiring a console or the game disc. The App is set to be
available on the Netrange App portal Europe wide for TCL consumers early next year, and
bring a "Netflix-like" consumption model to next generation console games.
"Premium Console quality experiences used to be restricted to the two console brands",
said Guy de Beer, Playcast Media CEO. "With our game streaming App, TCL is leapfrogging
established console vendors, and extends its value for money leadership to the games
space. With our App, TCL is becoming a larger gaming platform than Sony's Playstation 4 or
Microsoft's the Xbox One, that's quite astonishing".
"We are very excited about the launch of the console quality game streaming experience
at this year's IFA, being fully in line with TCL's current transformation from being a
traditional electronics manufacturer to an entertainment technology company," said Marek
Maciejewski, Product Development Director Europe at TCL Multimedia.
"This is fantastic news," said Jan Wendt, NetRange CEO. "This could be later seen as
the start of changing the gaming industry. We have experienced that in music or movies
before."
About TCL Corporation
Founded in 1981, TCL Corporation (000100.SZ) is one of the largest consumer
electronics enterprises in China, with over 70,000 employees in 40 countries throughout
the world. Currently it has three listed subsidiaries: TCL Multimedia (01070.HK), TCL
Communication (02618. HK), and Tonly Electronics (01249.HK), with a diverse business
portfolio covering LCD TVs, LCD panels, mobile phones, audio and video equipment, home
appliances and lighting products. In 2013, TCL's total sales reached RMB85.32 billion, and
the TCL brand value exceeded RMB63.9 billion. TCL is ranked No. 3 in market share of LCD
TVs, No. 5 in mobile phones, and No. 5 in LCD panels sector, on global basis. Starting
from 2014, TCL is focusing its goal of building new customer-centered "product + service"
business model, while pushing its transformation towards "smart + Internet technologies."
TCL is committed to its new vision of "enriching lives of its customers by rendering
products and services of ultimate experience."
Headquartered in China, TCL Multimedia Technology Holdings Limited (HKSE stock code:
01070) is one of the leading players in the global TV industry. TCL Multimedia is engaged
in the research and development, manufacturing and distribution of consumer electronic
products. Its ultimate holding company is TCL Corporation. According to the latest
DisplaySearch report, the Group ranked No.3 in the global LCD TV market share with a 6.8%
market share in 2013. The Group remained its No.1 position in the PRC LCD TV market with a
market share of 18.1%.
Playcast Media is the leading cloud gaming platform. The company's service features
the world's major video game brands and packages them as a monthly subscription and rental
models. The game streaming service is offered to users through devices such Smart TVs, set
top boxes, microconsoles and other video-enabled connected devices. Playcast's system has
been in commercial operation since 2011, serving hundreds of thousands of TV subscribers
in 55 countries. Playcast video game partners include renowned publishers such as
Electronic Arts, Ubisoft, Konami, Warner Bros, 2K, Namco Bandai, Square Enix, Capcom,
Codemasters, Disney, Sega, Atari, THQ, and a long list of indie studios. For more
information on the Playcast Media service, visit http://www.playcast-media.com.
About Netrange
NetRange is the leading global provider of white labeled, turnkey Smart TV and OTT
ecosystem. The company is operating an integrated, full-service solution which includes
billing, Point of Sale management, content aggregation and app development for more than
60 global TV and STB brands. Its fully featured content portfolio includes local and
global VoDs, linear TV broadcasters, sports, music and many other genres. NetRange is
processing on its white labeled store media transactions for TV users in over 90 countries
around the world.
Baltimore-Based NV3 Technologies Announces Website Launch Providing Charging and Digital Signage Solutions Worldwide
91% of all people on earth have a cell phone. 100% of those phones will need to be charged at some point, and NV3 Technologies is the solution!
BALTIMORE, Sept. 5, 2014 /PRNewswire/ -- Today, from their headquarters in Baltimore City, NV3 Technologies (NV3) announced the launch of their new website, which can be found at http://www.nv3tech.com. The website features NV3's latest emergency mobile device charging solutions, information about the unique free digital signage that is integrated into almost every unit they sell, and many examples of how NV3's charging and signage solutions are making an impact.
The NV3 team has incorporated their proprietary charging technology into a wide variety of products worldwide, which has allowed them to be the leader in the mobile device charging kiosk market for universities, hospitals, bars, mobile carriers, power companies, entrepreneurs, and advertising firms for the last seven years. These products include various charging kiosk solutions and digital signage options that can be found on the company's website.
As the creator and designer of the original Cell Phone Charging Kiosk, NV3 Technologies is keeping the world connected, one fast and efficient charge at a time. The consumers' needs are always progressing, and the Research and Development Department at NV3 is always moving forward with those advancing needs in mind. All kiosks are manufactured and built in Baltimore, Maryland and NV3 takes pride in being able to service and support the products they sell. "We don't plug charging cords into power strips behind our units," says Company Founder and CEO Ryan Doak. "Industrial charging cables are a part of our units and our technology is designed to track how many phones or tablets have been charged." NV3 is there every step of the way, from guiding the purchase decision, to providing long-term service and support for the products, and ultimately to helping track usage and determine the product's effectiveness as a business tool. "Keeping our customers happy by providing the solutions they need is as important as providing a charging service for the end customer," says COO and Founder Scott Calhoun.
ABOUT NV3 TECHNOLOGIES
NV3 (http://www.nv3tech.com) fabricates the original Cell Phone Charging Kiosk in Baltimore, Maryland. With their patent pending charging technology, and the integrated LED screen designed for marketing and advertising, NV3 has the tools and experience to help the world stay connected.
For additional information and to find out what NV3 Technologies can do for you, please visit http://www.nv3tech.com.